Inventor

LIAO KUO-HSIEN

TW25 patents

⚠️ This page may combine multiple inventors who share the name “LIAO KUO-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIAO KUO-HSIEN

ADVANCED SEMICONDUCTOR ENG

Semiconductor device packages with electromagnetic interference shielding

Wafer-level semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages

Semiconductor package structure and semiconductor process

Semiconductor device package and method of manufacturing the same

Semiconductor packages with thermal-enhanced conformal shielding and related methods

Semiconductor package device and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor packages with thermal-enhanced conformal shielding and related methods

Semiconductor device package

Semiconductor package structures and methods of manufacturing the same

Semiconductor package device and method of manufacturing the same

Optical device package and method for manufacturing the same

Package structure for wireless communication module

LIAO KUO-HSIEN

Semiconductor device packages having electromagnetic interference shielding and related methods

Chip package and manufacturing method thereof

Package having an inner shield and method for making the same

Semiconductor device packages with electromagnetic interference shielding

Semiconductor package integrated with conformal shield and antenna

Semiconductor device packages with electromagnetic interference shielding

Wireless communication module

YEN HAN-CHEE

Semiconductor package integrated with conformal shield and antenna

UNIVERSAL SCIENT IND SHANGHAI

Metallic cover of miniaturization module

LIN I-CHIA

Semiconductor packages with thermal dissipation structures and EMI shielding

UNIVERSAL SCIENT IND CO LTD

Miniaturized multi-chip module and method for manufacturing the same