Inventor
HIRANO ISAO
JP18 patents
⚠️ This page may combine multiple inventors who share the name “HIRANO ISAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO OHKA KOGYO CO LTD
9 patentsUS12485387B2Dec 2, 2025
Film cleaning solution and method for cleaning film
TOKYO OHKA KOGYO CO LTD0 citations62
US11981880B2May 14, 2024
Cleaning composition and cleaning method for component of semiconductor manufacturing process chamber
TOKYO OHKA KOGYO CO LTD0 citations62
US11441101B2Sep 13, 2022
Cleaning composition, cleaning method, and method for manufacturing semiconductor
TOKYO OHKA KOGYO CO LTD1 citations62
US11355362B2Jun 7, 2022
Washing method, washing device, storage medium, and washing composition
TOKYO OHKA KOGYO CO LTD1 citations62
US8354218B2Jan 15, 2013
Resist composition and method of forming resist pattern
TOKYO OHKA KOGYO CO LTD2 citations61
US7803512B2Sep 28, 2010
Positive resist composition and method of forming resist pattern
TOKYO OHKA KOGYO CO LTD4 citations61
US11222781B2Jan 11, 2022
Method for removing organic cured film on substrate, and acidic cleaning liquid
TOKYO OHKA KOGYO CO LTD0 citations52
US10155185B2Dec 18, 2018
Polyimide-based resin film cleaning liquid, method for cleaning polyimide-based resin film, method for producing polyimide coating, method for producing filter, filter medium, or filter device, and method for producing chemical solution for lithography
TOKYO OHKA KOGYO CO LTD0 citations41
US9212267B2Dec 15, 2015
Method of producing metal complex-supporting mesoporous material
TOKYO OHKA KOGYO CO LTD0 citations37
HIRANO ISAO
2 patentsUS8735052B2May 27, 2014
Surface modifying material, method of forming resist pattern, and method of forming pattern
HIRANO ISAO1 citations47
US9192994B2Nov 24, 2015
Method for producing substrate having dispersed particles of dendrimer compound on the surface thereof, and substrate having dispersed particles of dendrimer compound on the surface thereof
HIRANO ISAO0 citations33