P

Inventor

SAXOD KARINE

FR26 patents
⚠️ This page may combine multiple inventors who share the name “SAXOD KARINE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ST MICROELECTRONICS GRENOBLE 2

21 patents
US11688815B2Jun 27, 2023

Method for manufacturing a cover for an electronic package and electronic package comprising a cover

ST MICROELECTRONICS GRENOBLE 24 citations70
US10923638B2Feb 16, 2021

Electronic device comprising an optical chip and method of fabrication

ST MICROELECTRONICS GRENOBLE 22 citations70
US12066678B2Aug 20, 2024

Method of fabricating an electronic device comprising an optical chip

ST MICROELECTRONICS GRENOBLE 22 citations69
US11546059B2Jan 3, 2023

Cover for an electronic circuit package

ST MICROELECTRONICS GRENOBLE 20 citations62
US10965376B2Mar 30, 2021

Cover for an electronic circuit package

ST MICROELECTRONICS GRENOBLE 20 citations62
US10480994B2Nov 19, 2019

Electronic housing including a grooved cover

ST MICROELECTRONICS GRENOBLE 21 citations62
US12557424B2Feb 17, 2026

Electronic device comprising a carrier substrate and an encapsulating cover mounted on the carrier substrate, and corresponding mounting process

ST MICROELECTRONICS GRENOBLE 20 citations60
US12288835B2Apr 29, 2025

Electronic device comprising an optical chip and method of fabrication

ST MICROELECTRONICS GRENOBLE 20 citations60
US11664475B2May 30, 2023

Electronic device comprising a carrier substrate and an encapsulating cover mounted on the carrier substrate, and corresponding mounting process

ST MICROELECTRONICS GRENOBLE 20 citations60
US11244910B2Feb 8, 2022

Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring

ST MICROELECTRONICS GRENOBLE 20 citations60
US10483181B2Nov 19, 2019

Electronic package and fabrication method

ST MICROELECTRONICS GRENOBLE 21 citations60
US11609402B2Mar 21, 2023

Electronic device comprising an optical chip and method of fabrication

ST MICROELECTRONICS GRENOBLE 20 citations59
US11114312B2Sep 7, 2021

Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover

ST MICROELECTRONICS GRENOBLE 20 citations59
US11437527B2Sep 6, 2022

Encapsulation cover for an electronic package and fabrication process

ST MICROELECTRONICS GRENOBLE 21 citations55
US10998470B2May 4, 2021

Cover for an electronic circuit package

ST MICROELECTRONICS GRENOBLE 20 citations52
US9101077B2Aug 4, 2015

Electronic component package with a heat conductor

ST MICROELECTRONICS GRENOBLE 20 citations51
US10672721B2Jun 2, 2020

Method for fabricating an electronic device and a stacked electronic device

ST MICROELECTRONICS GRENOBLE 20 citations49
US10325784B2Jun 18, 2019

Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover

ST MICROELECTRONICS GRENOBLE 20 citations49
US10177098B2Jan 8, 2019

Method for fabricating an electronic device and a stacked electronic device

ST MICROELECTRONICS GRENOBLE 20 citations49
US10833208B2Nov 10, 2020

Method for manufacturing a cover for an electronic package and electronic package comprising a cover

ST MICROELECTRONICS GRENOBLE 20 citations48
US10483408B2Nov 19, 2019

Method for making a cover for an electronic package and electronic package comprising a cover

ST MICROELECTRONICS GRENOBLE 20 citations48

STMICROELECTRONICS (GRENOBLE 2) SAS

4 patents

ST MICROELECTRONICS INT NV

1 patent