P

Inventor

MATSUNO KOICHI

US54 patents
⚠️ This page may combine multiple inventors who share the name “MATSUNO KOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANDISK TECHNOLOGIES LLC

21 patents
US11387142B1Jul 12, 2022

Semiconductor device containing bit lines separated by air gaps and methods for forming the same

SANDISK TECHNOLOGIES LLC7 citations86
US11380707B2Jul 5, 2022

Three-dimensional memory device including backside trench support structures and methods of forming the same

SANDISK TECHNOLOGIES LLC9 citations86
US10985169B2Apr 20, 2021

Three-dimensional device with bonded structures including a support die and methods of making the same

SANDISK TECHNOLOGIES LLC14 citations86
US10727216B1Jul 28, 2020

Method for removing a bulk substrate from a bonded assembly of wafers

SANDISK TECHNOLOGIES LLC13 citations86
US11871580B2Jan 9, 2024

Three-dimensional memory device including low-k drain-select-level isolation structures and methods of forming the same

SANDISK TECHNOLOGIES LLC3 citations75
US11856765B2Dec 26, 2023

Three-dimensional memory device including low-k drain-select-level isolation structures and methods of forming the same

SANDISK TECHNOLOGIES LLC6 citations75
US11587920B2Feb 21, 2023

Bonded semiconductor die assembly containing through-stack via structures and methods for making the same

SANDISK TECHNOLOGIES LLC4 citations75
US12457742B2Oct 28, 2025

Three-dimensional memory device including trench bridges and methods of forming the same

SANDISK TECHNOLOGIES LLC1 citations64
US12243865B2Mar 4, 2025

Bonded semiconductor die assembly containing through-stack via structures and methods for making the same

SANDISK TECHNOLOGIES LLC0 citations63
US11127729B2Sep 21, 2021

Method for removing a bulk substrate from a bonded assembly of wafers

SANDISK TECHNOLOGIES LLC0 citations63
US12532463B2Jan 20, 2026

Three-dimensional memory device with separated source lines and method of making the same

SANDISK TECHNOLOGIES LLC0 citations62
US12457743B2Oct 28, 2025

Three-dimensional memory device including trench bridges and methods of forming the same

SANDISK TECHNOLOGIES LLC0 citations62
US12394718B2Aug 19, 2025

Three-dimensional memory device containing etch-stop structures and self-aligned insulating spacers and method of making the same

SANDISK TECHNOLOGIES LLC0 citations52
US12322710B2Jun 3, 2025

Three-dimensional memory device with finned support pillar structures and method of forming the same

SANDISK TECHNOLOGIES LLC0 citations52
US12288755B2Apr 29, 2025

Three-dimensional memory device containing deformation resistant trench fill structure and methods of making the same

SANDISK TECHNOLOGIES LLC0 citations52
US12255242B2Mar 18, 2025

Three-dimensional memory device including vertical stack of tubular graded silicon oxynitride portions

SANDISK TECHNOLOGIES LLC0 citations52
US12148710B2Nov 19, 2024

Three-dimensional memory device containing bridges for enhanced structural support and methods of forming the same

SANDISK TECHNOLOGIES LLC0 citations52
US12133388B2Oct 29, 2024

Three-dimensional memory device with self-aligned etch stop rings for a source contact layer and method of making the same

SANDISK TECHNOLOGIES LLC0 citations52
US12096632B2Sep 17, 2024

Three-dimensional memory device with multiple types of support pillar structures and method of forming the same

SANDISK TECHNOLOGIES LLC0 citations52
US12029036B2Jul 2, 2024

Three-dimensional memory device with multiple types of support pillar structures and method of forming the same

SANDISK TECHNOLOGIES LLC0 citations52
US12438100B2Oct 7, 2025

Three-dimensional memory device with multiple types of support pillar structures and method of forming the same

SANDISK TECHNOLOGIES LLC0 citations47

TOSHIBA KK

12 patents

SONY CORP

7 patents

MATSUNO KOICHI

3 patents

YAMAHA CORP

3 patents

TOSHIBA MEMORY CORP

2 patents

YANAI YOSHIHIRO

1 patent

KITAMURA YOSHINORI

1 patent

Showing the top 50 of 54 patents by PatentIndex Score.