Inventor
WOO SEUNGHAN
KR4 patents
Patents
4 patentsUS12250807B2Mar 11, 2025
Semiconductor device using different types of through-silicon-vias
SAMSUNG ELECTRONICS CO LTD0 citations59
US10784184B2Sep 22, 2020
Semiconductor device including through silicon vias distributing current
SAMSUNG ELECTRONICS CO LTD1 citations59
US11239210B2Feb 1, 2022
Semiconductor die for determining load of through silicon via and semiconductor device including the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US10916525B2Feb 9, 2021
Semiconductor die for determining load of through silicon via and semiconductor device including the same
SAMSUNG ELECTRONICS CO LTD0 citations57