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Inventor
OMURA NAOYUKI
JP
9 patents
⚠️ This page may combine multiple inventors who share the name “OMURA NAOYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UYEMURA C & CO LTD
3 patents
US7220347B2
May 22, 2007
Electrolytic copper plating bath and plating process therewith
UYEMURA C & CO LTD
27 citations
90
US7988842B2
Aug 2, 2011
Continuous copper electroplating method
UYEMURA C & CO LTD
2 citations
60
US7892411B2
Feb 22, 2011
Electrolytic copper plating process
UYEMURA C & CO LTD
1 citations
50
ISONO TOSHIHISA
3 patents
US9028668B2
May 12, 2015
Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath
ISONO TOSHIHISA
3 citations
59
US8679317B2
Mar 25, 2014
Copper electroplating bath
ISONO TOSHIHISA
3 citations
58
US9730337B2
Aug 8, 2017
Plating method
ISONO TOSHIHISA
0 citations
33
UEMURA KOGYO KK
2 patents
US11248305B2
Feb 15, 2022
Copper electrolytic plating bath and copper electrolytic plating film
UEMURA KOGYO KK
0 citations
56
US11560640B2
Jan 24, 2023
Filling plating system and filling plating method
UEMURA KOGYO KK
0 citations
42
OMURA NAOYUKI
1 patent
US8801912B2
Aug 12, 2014
Continuous copper electroplating method
OMURA NAOYUKI
0 citations
30