Inventor

HERRAULT FLORIAN G

US33 patents

⚠️ This page may combine multiple inventors who share the name “HERRAULT FLORIAN G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HERRAULT FLORIAN G

HRL LAB LLC

Wafer-level die to package and die to die interconnects suspended over integrated heat sinks

Recursive metal embedded chip assembly

Direct IC-to-package wafer level packaging with integrated thermal heat spreaders

Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers

Wafer-level die to package and die to die interconnects suspended over integrated heat sinks

Methods to design and uniformly co-fabricate small vias and large cavities through a substrate

Interposer with interconnects and methods of manufacturing the same

Method to protect die during metal-embedded chip assembly (MECA) process

Recursive metal embedded chip assembly

Integrated RF subsystem

Hybrid integrated circuit architecture

Formation of high-resolution patterns inside deep cavities and applications to RF SI-embedded inductors

Electrostatically driven assembly of nanoparticle materials into dense films

Method and apparatus for integrated shielded circulator

Photonic integrated module with metal embedded chips

Wafer-level integrated micro-structured heat spreaders

Method and apparatus to increase radar range

Offset patterned micro-lens and micro-optical bench including the same

Impedance-matched through-wafer transition using integrated heat-spreader technology

Magnetically anisotropic binder-free films containing discrete hexaferrite nanoplatelets

Low-temperature-deposited self-biased magnetic composite films containing discrete hexaferrite platelets

Magnetically anisotropic binder-free films containing discrete hexaferrite nanoplatelets

Interposer for curved detector

Singulation process for chiplets

Through-wafer coaxial transition

Hybrid integrated circuit architecture

Laminated conductors

Laminated conductors

Formation of high-resolution patterns inside deep cavities and applications to RF Si-embedded inductors

Method for creating cavities in silicon carbide and other semiconductor substrates

Methods for making hydrothermally crystallized water-dispersible hexaferrite platelets

HRL LABORATORIES LLC

Photonic integrated module with metal embedded chips

GM GLOBAL TECH OPERATIONS LLC

Radar system with frequency conversion and corresponding method