P

Inventor

YANG KAI

CN233 patents
⚠️ This page may combine multiple inventors who share the name “YANG KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED MICRO DEVICES INC

19 patents
US6468894B1Oct 22, 2002

Metal interconnection structure with dummy vias

ADVANCED MICRO DEVICES INC109 citations98
US6113462ASep 5, 2000

Feedback loop for selective conditioning of chemical mechanical polishing pad

ADVANCED MICRO DEVICES INC95 citations98
US6103085AAug 15, 2000

Electroplating uniformity by diffuser design

ADVANCED MICRO DEVICES INC134 citations98
US6734559B1May 11, 2004

Self-aligned semiconductor interconnect barrier and manufacturing method therefor

ADVANCED MICRO DEVICES INC59 citations96
US6410418B1Jun 25, 2002

Recess metallization via selective insulator formation on nucleation/seed layer

ADVANCED MICRO DEVICES INC57 citations96
US6350687B1Feb 26, 2002

Method of fabricating improved copper metallization including forming and removing passivation layer before forming capping film

ADVANCED MICRO DEVICES INC75 citations96
US6259115B1Jul 10, 2001

Dummy patterning for semiconductor manufacturing processes

ADVANCED MICRO DEVICES INC69 citations96
US6218290B1Apr 17, 2001

Copper dendrite prevention by chemical removal of dielectric

ADVANCED MICRO DEVICES INC56 citations96
US6143656ANov 7, 2000

Slurry for chemical mechanical polishing of copper

ADVANCED MICRO DEVICES INC67 citations96
US6074949AJun 13, 2000

Method of preventing copper dendrite formation and growth

ADVANCED MICRO DEVICES INC72 citations96
US7132363B2Nov 7, 2006

Stabilizing fluorine etching of low-k materials

ADVANCED MICRO DEVICES INC28 citations93
US6410442B1Jun 25, 2002

Mask-less differential etching and planarization of copper films

ADVANCED MICRO DEVICES INC35 citations93
US6350678B1Feb 26, 2002

Chemical-mechanical polishing of semiconductors

ADVANCED MICRO DEVICES INC38 citations93
US6605843B1Aug 12, 2003

Fully depleted SOI device with tungsten damascene contacts and method of forming same

ADVANCED MICRO DEVICES INC31 citations92
US6596637B1Jul 22, 2003

Chemically preventing Cu dendrite formation and growth by immersion

ADVANCED MICRO DEVICES INC22 citations92
US6319833B1Nov 20, 2001

Chemically preventing copper dendrite formation and growth by spraying

ADVANCED MICRO DEVICES INC21 citations92
US6207569B1Mar 27, 2001

Prevention of Cu dendrite formation and growth

ADVANCED MICRO DEVICES INC18 citations92
US6169034B1Jan 2, 2001

Chemically removable Cu CMP slurry abrasive

ADVANCED MICRO DEVICES INC23 citations92
US6140239AOct 31, 2000

Chemically removable Cu CMP slurry abrasive

ADVANCED MICRO DEVICES INC44 citations92

BIOLOG DYNAMICS INC

10 patents

BEIJING NIU INFORMATION TECH CO LTD

5 patents

TENCENT TECH SHENZHEN CO LTD

4 patents

HUAWEI TECH CO LTD

2 patents

SHENZHEN HIPPO TRADING CO LTD

2 patents

FUTUREWEI TECHNOLOGIES INC

2 patents

BEIJING NIU TECH CO LTD

2 patents

Biological dynamics inc

1 patent

SIEMENS SCHWEIZ AG

1 patent

MICHELIN & CIE

1 patent

BADAWI RAMSEY D

1 patent

Showing the top 50 of 233 patents by PatentIndex Score.