Inventor
GENG PHIL
US20 patents
Patents
20 patentsUS6833615B2Dec 21, 2004
Via-in-pad with off-center geometry
INTEL CORP52 citations94
US6622905B2Sep 23, 2003
Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias
INTEL CORP26 citations84
US7208348B2Apr 24, 2007
Methods of fabricating a via-in-pad with off-center geometry
INTEL CORP12 citations82
US10950958B2Mar 16, 2021
Memory module connector, memory module, and pivotable latch
INTEL CORP3 citations73
US10888010B2Jan 5, 2021
Retention of dual in-line memory modules
INTEL CORP2 citations73
US12453054B2Oct 21, 2025
Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass
INTEL CORP0 citations62
US12334674B2Jun 17, 2025
DIMM retention assembly for compression mount technology and land grid array connector loading
INTEL CORP0 citations62
US11587597B2Feb 21, 2023
Connector retention mechanism for improved structural reliability
INTEL CORP0 citations62
US12315780B2May 27, 2025
Technologies for processor loading mechanisms
INTEL CORP0 citations61
US12133357B2Oct 29, 2024
Cold plate architecture for liquid cooling of devices
INTEL CORP1 citations60
US12494441B2Dec 9, 2025
BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load
INTEL CORP0 citations59
US12309933B2May 20, 2025
Magnetically secured semiconductor chip package loading assembly
INTEL CORP0 citations59
US12279395B2Apr 15, 2025
Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention
INTEL CORP0 citations58
US12131977B2Oct 29, 2024
Electronic systems with inverted circuit board with heat sink to chassis attachment
INTEL CORP0 citations58
US11842943B2Dec 12, 2023
Electronic systems with inverted circuit board with heat sink to chassis attachment
INTEL CORP0 citations58
US12476167B2Nov 18, 2025
Semiconductor chip package thermo-mechanical cooling assembly
INTEL CORP0 citations52
US11984685B2May 14, 2024
Retention latch with spring mechanism
INTEL CORP0 citations52
US11495518B2Nov 8, 2022
Multi-surface heat sink suitable for multi-chip packages
INTEL CORP1 citations52
US12309966B2May 20, 2025
Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force
INTEL CORP0 citations50
US10790603B2Sep 29, 2020
Connector with relaxation mechanism for latch
INTEL CORP0 citations42