Inventor

SHIA DAVID

US38 patents

⚠️ This page may combine multiple inventors who share the name “SHIA DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIA DAVID

INTEL CORP

Heat sink mounting and interface mechanism and method of assembling same

Securing heat sinks

Securing heat sinks

Structural reinforcement for electronic substrate

Heat sink retention frame

Movable heatsink utilizing flexible heat pipes

Scalable, high load, low stiffness, and small footprint loading mechanism

Adjustable heat pipe thermal unit

Vacuum modulated two phase cooling loop efficiency and parallelism enhancement

Converged test platforms and processes for class and system testing of integrated circuits

Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass

Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems

Vacuum modulated two phase cooling loop performance enhancement

Micro positioning test socket and methods for active precision alignment and co-planarity feedback

Technologies for processor loading mechanisms

Cold plate architecture for liquid cooling of devices

Circuit devices integrated with boiling enhancement for two-phase immersion cooling

Magnetically secured semiconductor chip package loading assembly

Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention

Electronic systems with inverted circuit board with heat sink to chassis attachment

Electronic systems with inverted circuit board with heat sink to chassis attachment

Directly impinging pressure modulated spray cooling and methods of target temperature control

Boiling enhancement structures for immersion cooled electronic systems

Conformable cold plate for fluid cooling applications

Liquid cooling system leak detection improvements

Conformable cold plate for fluid cooling applications

Fine pitch probe card methods and systems

Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force

Etching for probe wire tips for microelectronic device test

Technologies for liquid cooling interfaces

Composite wire probe test assembly

SHIA DAVID

Sort probe gripper

Anti-rotation for wire probes in a probe head of a die tester

Composite wire probes for testing integrated circuits

DETOFSKY ABRAM M

Micro positioning test socket and methods for active precision alignment and co-planarity feedback

ALBERTSON TODD P

Wire probe assembly and forming process for die testing

RUTIGLIANO MICHAEL L

Positioning and socketing for semiconductor dice

SWART ROY E

Test probe structures and methods including positioning test probe structures in a test head