Inventor

AHUJA SANDEEP

US29 patents

⚠️ This page may combine multiple inventors who share the name “AHUJA SANDEEP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AHUJA SANDEEP

INTEL CORP

Piezo fans for cooling an electronic device

Heat sink mounting and interface mechanism and method of assembling same

Cooling arrangement to cool components on circuit board

Integrated heat spreader that maximizes heat transfer from a multi-chip package

Thermal throttling of electronic devices

Determining thermal margins in a multi-die processor

Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass

System, apparatus and method for controllable processor configuration based on a temperature specification

Technologies for processor loading mechanisms

Apparatus and method to provide a thermal parameter report for a multi-chip package

Apparatus and method to provide a thermal parameter report for a multi-chip package

Magnetically secured semiconductor chip package loading assembly

Electronic systems with inverted circuit board with heat sink to chassis attachment

Electronic systems with inverted circuit board with heat sink to chassis attachment

Determining thermal margins in a multi-die processor

Multi-surface heat sink suitable for multi-chip packages

Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force

Securing thermal management parameters in firmware from cyber attack

Processor having frequency of operation information for guaranteed operation under high temperature events

Maintenance prediction of electronic devices using periodic thermal evaluation

AHUJA SANDEEP

Integrated heat spreader that maximizes heat transfer from a multi-chip package

Sensor-based thermal specification enabling a real-time metric for compliance

Sensor-based thermal specification enabling a real-time metric for compliance

Securing thermal management parameters in firmware from cyber attack

Transient thermal management systems for semiconductor devices

MAYTAG CORP

Combination heating system for a cooking appliance

STEINBRECHER ROBIN A

Power and thermal optimization of processor and cooling

INST GAS TECHNOLOGY

Cooking process

Chopson Patrick Mark

Automated building design guidance software that optimizes cost, energy, daylight, glare, and thermal comfort