Inventor
BUDDRIUS ERIC W
US13 patents
⚠️ This page may combine multiple inventors who share the name “BUDDRIUS ERIC W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS9646910B2May 9, 2017
Integrated heat spreader that maximizes heat transfer from a multi-chip package
INTEL CORP13 citations82
US11449111B2Sep 20, 2022
Scalable, high load, low stiffness, and small footprint loading mechanism
INTEL CORP6 citations73
US9825387B2Nov 21, 2017
Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusion
INTEL CORP3 citations70
US11291115B2Mar 29, 2022
Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets
INTEL CORP2 citations68
US12315780B2May 27, 2025
Technologies for processor loading mechanisms
INTEL CORP0 citations61
US11387163B2Jul 12, 2022
Scalable debris-free socket loading mechanism
INTEL CORP0 citations61
US12176643B2Dec 24, 2024
Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigation
INTEL CORP0 citations60
US11818832B2Nov 14, 2023
Socket load regulation utilizing CPU carriers with shim components
INTEL CORP0 citations60
US12279395B2Apr 15, 2025
Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention
INTEL CORP0 citations58
US11557529B2Jan 17, 2023
Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions
INTEL CORP0 citations58
US12442712B2Oct 14, 2025
Liquid cooling system leak detection improvements
INTEL CORP0 citations55
US10680367B2Jun 9, 2020
Cable retention assemblies including torsional elements
INTEL CORP0 citations49