Inventor
HUANG SIN-YAO
TW25 patents
⚠️ This page may combine multiple inventors who share the name “HUANG SIN-YAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
24 patentsUS9704827B2Jul 11, 2017
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD32 citations98
US11694979B2Jul 4, 2023
Isolation structure for bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations86
US10991667B2Apr 27, 2021
Isolation structure for bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US11069736B2Jul 20, 2021
Via support structure under pad areas for BSI bondability improvement
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10566374B2Feb 18, 2020
Via support structure under pad areas for BSI bondability improvement
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10283549B2May 7, 2019
Via support structure under pad areas for BSI bondability improvement
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10038025B2Jul 31, 2018
Via support structure under pad areas for BSI bondability improvement
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10038026B2Jul 31, 2018
Bond pad structure for bonding improvement
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11804473B2Oct 31, 2023
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11244981B2Feb 8, 2022
Bond pad structure for bonding improvement
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10475758B2Nov 12, 2019
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10269770B2Apr 23, 2019
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11335716B2May 17, 2022
Photosensing pixel, image sensor and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12424577B2Sep 23, 2025
Isolation structure for bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12400984B2Aug 26, 2025
Isolation structure for bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300670B2May 13, 2025
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11894410B2Feb 6, 2024
Bond pad structure for bonding improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11282802B2Mar 22, 2022
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11024602B2Jun 1, 2021
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12532558B2Jan 20, 2026
Photosensing pixel, image sensor and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12396272B2Aug 19, 2025
Stilted pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10515995B2Dec 24, 2019
Bond pad structure for bonding improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9881884B2Jan 30, 2018
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12527100B2Jan 13, 2026
Stepped back side deep trench isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47