Inventor

Liao li-ling

TW18 patents

⚠️ This page may combine multiple inventors who share the name “Liao li-ling”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Liao li-ling

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and method of forming the same

Organic interposer including intra-die structural reinforcement structures and methods of forming the same

Organic interposer including intra-die structural reinforcement structures and methods of forming the same

Package structure containing chip structure with inclined sidewalls

Buffer block structures for C4 bonding and methods of using the same

Organic interposer including intra-die structural reinforcement structures and methods of forming the same

Package structure and method for forming the same

Chip package structure

Package structure and method for forming the same

Structure and formation method of package containing chip structure with inclined sidewalls

Chip package structure and method for forming the same

Package structure and method for forming the same

Two-piece type stiffener structure with beveled surface for delamination reduction and methods for forming the same

Chip package structure including an underfill material portion comprising a cut region

Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same

DAI MING-JI

Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices

IND TECH RES INST

Intelligent diagnosis system for power module and method thereof

LIU CHUN-KAI

Thermoelectric apparatus and method of fabricating the same