Inventor
KIM MICHELLE YEJIN
US7 patents
Patents
7 patentsUS11791320B2Oct 17, 2023
Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods
QUALCOMM INC0 citations61
US12581966B2Mar 17, 2026
Electronic component placed on core of substrate
QUALCOMM INC0 citations60
US12500146B2Dec 16, 2025
Substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength, and related IC packages and fabrication methods
QUALCOMM INC0 citations60
US11527498B2Dec 13, 2022
Bump pad structure
QUALCOMM INC0 citations59
US11676905B2Jun 13, 2023
Integrated circuit (IC) package with stacked die wire bond connections, and related methods
QUALCOMM INC0 citations55
US12424559B2Sep 23, 2025
Package with a substrate comprising embedded escape interconnects and surface escape interconnects
QUALCOMM INC0 citations50
US12362269B2Jul 15, 2025
Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods
QUALCOMM INC0 citations49