Inventor
KANG KUIWON
US31 patents
Patents
31 patentsUS9679841B2Jun 13, 2017
Substrate and method of forming the same
QUALCOMM INC11 citations82
US11444019B2Sep 13, 2022
Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package
QUALCOMM INC2 citations73
US10622292B2Apr 14, 2020
High density interconnects in an embedded trace substrate (ETS) comprising a core layer
QUALCOMM INC3 citations72
US10157824B2Dec 18, 2018
Integrated circuit (IC) package and package substrate comprising stacked vias
QUALCOMM INC3 citations68
US11776888B2Oct 3, 2023
Package with a substrate comprising protruding pad interconnects
QUALCOMM INC0 citations62
US11637057B2Apr 25, 2023
Uniform via pad structure having covered traces between partially covered pads
QUALCOMM INC0 citations62
US11075260B2Jul 27, 2021
Substrate comprising recessed interconnects and a surface mounted passive component
QUALCOMM INC0 citations62
US10971455B2Apr 6, 2021
Ground shield plane for ball grid array (BGA) package
QUALCOMM INC0 citations62
US11791320B2Oct 17, 2023
Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods
QUALCOMM INC0 citations61
US12581966B2Mar 17, 2026
Electronic component placed on core of substrate
QUALCOMM INC0 citations60
US12500146B2Dec 16, 2025
Substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength, and related IC packages and fabrication methods
QUALCOMM INC0 citations60
US11764076B2Sep 19, 2023
Semi-embedded trace structure with partially buried traces
QUALCOMM INC0 citations60
US11527498B2Dec 13, 2022
Bump pad structure
QUALCOMM INC0 citations59
US10679919B2Jun 9, 2020
High thermal release interposer
QUALCOMM INC1 citations59
US11552023B2Jan 10, 2023
Passive component embedded in an embedded trace substrate (ETS)
QUALCOMM INC0 citations58
US11404343B2Aug 2, 2022
Package comprising a substrate configured as a heat spreader
QUALCOMM INC1 citations58
US11676905B2Jun 13, 2023
Integrated circuit (IC) package with stacked die wire bond connections, and related methods
QUALCOMM INC0 citations55
US11605595B2Mar 14, 2023
Packages with local high-density routing region embedded within an insulating layer
QUALCOMM INC0 citations52
US11552015B2Jan 10, 2023
Substrate comprising a high-density interconnect portion embedded in a core layer
QUALCOMM INC0 citations52
US11545435B2Jan 3, 2023
Double sided embedded trace substrate
QUALCOMM INC0 citations52
US11545439B2Jan 3, 2023
Package comprising an integrated device coupled to a substrate through a cavity
QUALCOMM INC0 citations52
US10879158B2Dec 29, 2020
Split conductive pad for device terminal
QUALCOMM INC0 citations52
US9370097B2Jun 14, 2016
Package substrate with testing pads on fine pitch traces
QUALCOMM INC0 citations51
US12424559B2Sep 23, 2025
Package with a substrate comprising embedded escape interconnects and surface escape interconnects
QUALCOMM INC0 citations50
US12354935B2Jul 8, 2025
Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods
QUALCOMM INC0 citations50
US12362269B2Jul 15, 2025
Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods
QUALCOMM INC0 citations49
US11437335B2Sep 6, 2022
Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods
QUALCOMM INC0 citations49
US11342254B2May 24, 2022
Multi-dielectric structure in two-layer embedded trace substrate
QUALCOMM INC0 citations49
US10804195B2Oct 13, 2020
High density embedded interconnects in substrate
QUALCOMM INC0 citations49
US12593408B2Mar 31, 2026
Package substrate having embedded electronic component in a core of the package substrate
QUALCOMM INC0 citations47
US10651160B2May 12, 2020
Low profile integrated package
QUALCOMM INC0 citations46