Inventor

HSIA HSING-KUO

TW85 patents

⚠️ This page may combine multiple inventors who share the name “HSIA HSING-KUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIA HSING-KUO

TAIWAN SEMICONDUCTOR MFG CO LTD

Semicondcutor package

Photonic semiconductor device and method of manufacture

Hybrid integrated circuit package and method

Hybrid interconnect device and method

Photonic semiconductor device and method of manufacture

Photonic semiconductor device and method of manufacture

Hybrid interconnect device and method

Photonic semiconductor device and method

Photonic semiconductor device and method

Hybrid integrated circuit package and method

Optical transceiver and manufacturing method thereof

Semicondcutor packages

Photonic semiconductor device and method of manufacture

Photonic package and method of manufacture

Photonic semiconductor device and method of manufacture

Photonic semiconductor device and method of manufacture

Devices, systems, and methods for optical signal processing

Integrated 3DIC with stacked photonic dies and method forming same

Photonic semiconductor device and method of manufacture

Hybrid integrated circuit package and method

Photonic semiconductor device and method of manufacture

Optical transceiver and manufacturing method thereof

Photonic semiconductor device and method

Methods of forming semiconductor packages

Photonic semiconductor device and method

Optical semiconductor package and method for manufacturing the same

Method of forming a dummy die of an integrated circuit having an embedded annular structure

Integrated 3DIC with stacked photonic dies and method forming same

Photonic package and method of manufacture

Structure and process for photonic packages

Hybrid integrated circuit packages

Photonic semiconductor device and method of manufacture

Optical transceiver and manufacturing method thereof

Photonic semiconductor device and method of manufacture

Structure and process for photonic packages

Hybrid integrated circuit package

Package structure including photonic package and interposer having waveguide

Grating coupler and method of manufacturing the same

Photonic semiconductor device and method

Photonic semiconductor device and method

Optical connection structures for a photonic assembly and methods for forming the same

Package structure having grating coupler and manufacturing method thereof

YU CHIH-KUANG

Methods of fabricating light emitting diode packages

Methods of fabricating light emitting diode packages

HSIA HSING-KUO

Micro-interconnects for light-emitting diodes

Laser etch via formation

TSMC SOLID STATE LIGHTING LTD

LED with IC integrated lighting module

LED device with improved thermal performance

CHEM CHYI SHYUAN

Method of forming a light emitting diode emitter substrate with highly reflective metal bonding

EPISTAR CORP

Dicing-free LED fabrication