Inventor

HUANG SUNG-HUI

TW93 patents

⚠️ This page may combine multiple inventors who share the name “HUANG SUNG-HUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

42 patents

US11493689B2Nov 8, 2022

Photonic semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94

US10267988B2Apr 23, 2019

Photonic package and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD24 citations93

US11852868B2Dec 26, 2023

Photonic semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations86

US11569156B2Jan 31, 2023

Semiconductor device, electronic device including the same, and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations86

US11222867B1Jan 11, 2022

Package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations86

US12237288B2Feb 25, 2025

Semiconductor die package and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85

US10746923B2Aug 18, 2020

Photonic semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD14 citations85

US10866373B2Dec 15, 2020

Optical transceiver and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84

US10770405B2Sep 8, 2020

Thermal interface material having different thicknesses in packages

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84

US10707177B2Jul 7, 2020

Thermal interface material having different thicknesses in packages

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84

US10790254B2Sep 29, 2020

Chip package structure

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83

US10629545B2Apr 21, 2020

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83

US10459159B2Oct 29, 2019

Photonic package and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83

US11990443B2May 21, 2024

Semiconductor die package and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74

US11705407B2Jul 18, 2023

Package structure and fabricating method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US11694939B2Jul 4, 2023

Semiconductor package, integrated optical communication system

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73

US11502015B2Nov 15, 2022

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11502056B2Nov 15, 2022

Joint structure in semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11454773B2Sep 27, 2022

Optical transceiver and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US11450580B2Sep 20, 2022

Semiconductor structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11437334B2Sep 6, 2022

Chip package structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11424219B2Aug 23, 2022

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73

US11270956B2Mar 8, 2022

Package structure and fabricating method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US11156772B2Oct 26, 2021

Photonic semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10978346B2Apr 13, 2021

Conductive vias in semiconductor packages and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10948668B2Mar 16, 2021

Package structure for optical fiber and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10886147B1Jan 5, 2021

Package structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73

US10847485B2Nov 24, 2020

Chip package structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11764123B2Sep 19, 2023

Semiconductor package, integrated optical communication system

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72

US11150404B2Oct 19, 2021

Photonic package and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72

US11101260B2Aug 24, 2021

Method of forming a dummy die of an integrated circuit having an embedded annular structure

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72

US10985125B2Apr 20, 2021

Chip package structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72

US11916023B2Feb 27, 2024

Thermal interface material having different thicknesses in packages

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71

US12362196B2Jul 15, 2025

Package structure with underfill

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12253729B2Mar 18, 2025

Optical transceiver and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12242108B2Mar 4, 2025

Photonic semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12165992B2Dec 10, 2024

Package structure and fabricating method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12033969B2Jul 9, 2024

Chip package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11630271B2Apr 18, 2023

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11428879B2Aug 30, 2022

Method for forming a package structure for optical fiber

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11328936B2May 10, 2022

Structure and formation method of package structure with underfill

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US9698115B2Jul 4, 2017

Three-dimensional chip stack and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63

TAIWAN SEMICONDUCTOR MFG

2 patents

US9355980B2May 31, 2016

Three-dimensional chip stack and method of forming the same

TAIWAN SEMICONDUCTOR MFG19 citations93

US8895385B2Nov 25, 2014

Methods of forming semiconductor structures

TAIWAN SEMICONDUCTOR MFG10 citations84

E INK HOLDINGS INC

2 patents

US8835913B2Sep 16, 2014

Transistor structure

E INK HOLDINGS INC9 citations84

US8350260B2Jan 8, 2013

Transistor structure

E INK HOLDINGS INC10 citations84

HUANG SUNG-HUI

1 patent

US8576475B2Nov 5, 2013

MEMS switch

HUANG SUNG-HUI109 citations97

HSIAO PO-WEN

1 patent

US8466614B2Jun 18, 2013

Front light plate and reflective display apparatus using the same

HSIAO PO-WEN7 citations84

TSAI YAO-CHOU

1 patent

US8791909B2Jul 29, 2014

Display panel

TSAI YAO-CHOU8 citations83

CHANG CHUN HUA

1 patent

US8552485B2Oct 8, 2013

Semiconductor structure having metal-insulator-metal capacitor structure

CHANG CHUN HUA12 citations82

Showing the top 50 of 93 patents by PatentIndex Score.