Inventor
HUANG KUAN-YU
TW56 patents
Patents
50 patentsUS11569156B2Jan 31, 2023
Semiconductor device, electronic device including the same, and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations86
US11222867B1Jan 11, 2022
Package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations86
US12237288B2Feb 25, 2025
Semiconductor die package and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85
US11075133B2Jul 27, 2021
Underfill structure for semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10866373B2Dec 15, 2020
Optical transceiver and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10770405B2Sep 8, 2020
Thermal interface material having different thicknesses in packages
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10707177B2Jul 7, 2020
Thermal interface material having different thicknesses in packages
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10790254B2Sep 29, 2020
Chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US10629545B2Apr 21, 2020
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11990443B2May 21, 2024
Semiconductor die package and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11705407B2Jul 18, 2023
Package structure and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11694939B2Jul 4, 2023
Semiconductor package, integrated optical communication system
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11621205B2Apr 4, 2023
Underfill structure for semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11502056B2Nov 15, 2022
Joint structure in semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11502015B2Nov 15, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11454773B2Sep 27, 2022
Optical transceiver and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11450580B2Sep 20, 2022
Semiconductor structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11437334B2Sep 6, 2022
Chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11270956B2Mar 8, 2022
Package structure and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11024616B2Jun 1, 2021
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10886147B1Jan 5, 2021
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10847485B2Nov 24, 2020
Chip package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11764123B2Sep 19, 2023
Semiconductor package, integrated optical communication system
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11101260B2Aug 24, 2021
Method of forming a dummy die of an integrated circuit having an embedded annular structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10985125B2Apr 20, 2021
Chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11916023B2Feb 27, 2024
Thermal interface material having different thicknesses in packages
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US12362196B2Jul 15, 2025
Package structure with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12253729B2Mar 18, 2025
Optical transceiver and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12165992B2Dec 10, 2024
Package structure and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12033969B2Jul 9, 2024
Chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11328936B2May 10, 2022
Structure and formation method of package structure with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12469821B2Nov 11, 2025
Packages with multiple types of underfill and method forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368132B2Jul 22, 2025
Joint structure in semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12294002B2May 6, 2025
Integrated circuit package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12165990B2Dec 10, 2024
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12148678B2Nov 19, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12124078B2Oct 22, 2024
Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12087727B2Sep 10, 2024
Joint structure in semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12087733B2Sep 10, 2024
Packages with multiple types of underfill and method forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080617B2Sep 3, 2024
Underfill structure for semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051668B2Jul 30, 2024
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12015023B2Jun 18, 2024
Integrated circuit package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12002721B2Jun 4, 2024
Method of fabricating semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11842936B2Dec 12, 2023
Underfill structure for semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11699674B2Jul 11, 2023
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11587886B2Feb 21, 2023
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11201097B2Dec 14, 2021
Method of manufacture of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11121050B2Sep 14, 2021
Method of manufacture of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11101236B2Aug 24, 2021
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12327781B2Jun 10, 2025
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
Showing the top 50 of 56 patents by PatentIndex Score.