Inventor

TING KUO-CHIANG

TW64 patents

⚠️ This page may combine multiple inventors who share the name “TING KUO-CHIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

46 patents

US11493689B2Nov 8, 2022

Photonic semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94

US10867954B2Dec 15, 2020

Interconnect chips

TAIWAN SEMICONDUCTOR MFG CO LTD14 citations94

US10720401B2Jul 21, 2020

Interconnect chips

TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94

US10050042B2Aug 14, 2018

SRAM cell and logic cell design

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations93

US9805984B2Oct 31, 2017

FinFET device

TAIWAN SEMICONDUCTOR MFG CO LTD13 citations92

US9659810B2May 23, 2017

Method of making a FinFET device

TAIWAN SEMICONDUCTOR MFG CO LTD14 citations92

US11852868B2Dec 26, 2023

Photonic semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations86

US10746923B2Aug 18, 2020

Photonic semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD14 citations85

US10866373B2Dec 15, 2020

Optical transceiver and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84

US10720436B2Jul 21, 2020

SRAM cell and logic cell design

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84

US10546786B2Jan 28, 2020

Method of fabricating a FinFET device

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84

US10515888B2Dec 24, 2019

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84

US10510722B2Dec 17, 2019

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84

US10468418B2Nov 5, 2019

SRAM cell and logic cell design

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US10304800B2May 28, 2019

Packaging with substrates connected by conductive bumps

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84

US12038599B2Jul 16, 2024

Photonic package and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations75

US11978714B2May 7, 2024

Encapsulated package including device dies connected via interconnect die

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US11747563B2Sep 5, 2023

Photonic semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11592618B2Feb 28, 2023

Photonic semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

US11508696B2Nov 22, 2022

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11476184B2Oct 18, 2022

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

US11462418B2Oct 4, 2022

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73

US11454773B2Sep 27, 2022

Optical transceiver and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US11380611B2Jul 5, 2022

Chip-on-wafer structure with chiplet interposer

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73

US11156772B2Oct 26, 2021

Photonic semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10515869B1Dec 24, 2019

Semiconductor package structure having a multi-thermal interface material structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10170457B2Jan 1, 2019

COWOS structures and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73

US10062614B2Aug 28, 2018

FinFET device

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US9449971B2Sep 20, 2016

Methods of forming FinFETs

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73

US11164855B2Nov 2, 2021

Package structure with a heat dissipating element and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations72

US11728238B2Aug 15, 2023

Semiconductor package with heat dissipation films and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71

US11139282B2Oct 5, 2021

Semiconductor package structure and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71

US12442978B2Oct 14, 2025

Photonic package and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12392961B2Aug 19, 2025

Structure and process for photonic packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12259578B2Mar 25, 2025

Photonic semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12253729B2Mar 18, 2025

Optical transceiver and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12242108B2Mar 4, 2025

Photonic semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12135454B2Nov 5, 2024

Structure and process for photonic packages

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63

US11980015B2May 7, 2024

SRAM cell and logic cell design

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11508737B2Nov 22, 2022

SRAM cell and logic cell design

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12564057B2Feb 24, 2026

Chiplet interposer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12564082B2Feb 24, 2026

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12400878B2Aug 26, 2025

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12334464B2Jun 17, 2025

Encapsulated package including device dies connected via interconnect die

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12322729B2Jun 3, 2025

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12080638B2Sep 3, 2024

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

SHEN CHUN-LIANG

1 patent

US8729634B2May 20, 2014

FinFET with high mobility and strain channel

SHEN CHUN-LIANG581 citations95

YIN JOANNA CHAW YANE

1 patent

US8697515B2Apr 15, 2014

Method of making a FinFET device

YIN JOANNA CHAW YANE51 citations95

LIN JR JUNG

1 patent

US8912610B2Dec 16, 2014

Structure and method for MOSFETS with high-K and metal gate structure

LIN JR JUNG22 citations89

LI HOU-JU

1 patent

US9368628B2Jun 14, 2016

FinFET with high mobility and strain channel

LI HOU-JU3 citations67

Showing the top 50 of 64 patents by PatentIndex Score.