Inventor
NAKAZATO YASUAKI
JP16 patents
⚠️ This page may combine multiple inventors who share the name “NAKAZATO YASUAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU HANDOTAI KK
10 patentsUS5232870AAug 3, 1993
Method for production of bonded wafer
SHINETSU HANDOTAI KK61 citations96
US5395788AMar 7, 1995
Method of producing semiconductor substrate
SHINETSU HANDOTAI KK67 citations95
US5071785ADec 10, 1991
Method for preparing a substrate for forming semiconductor devices by bonding warped wafers
SHINETSU HANDOTAI KK64 citations95
US5266824ANov 30, 1993
SOI semiconductor substrate
SHINETSU HANDOTAI KK27 citations92
US5223080AJun 29, 1993
Method for controlling thickness of single crystal thin-film layer in soi substrate
SHINETSU HANDOTAI KK29 citations92
US5032544AJul 16, 1991
Process for producing semiconductor device substrate using polishing guard
SHINETSU HANDOTAI KK48 citations92
US5191738AMar 9, 1993
Method of polishing semiconductor wafer
SHINETSU HANDOTAI KK71 citations91
US5800251ASep 1, 1998
Apparatus and method of lapping works
SHINETSU HANDOTAI KK9 citations72
US5213657AMay 25, 1993
Method for making uniform the thickness of a si single crystal thin film
SHINETSU HANDOTAI KK6 citations62
US5931147AAug 3, 1999
Method of cutting a workpiece with a wire saw
SHINETSU HANDOTAI KK2 citations54