Inventor
CHEN SHANG-WEI
TW17 patents
⚠️ This page may combine multiple inventors who share the name “CHEN SHANG-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
5 patentsUS8354338B2Jan 15, 2013
Carrier board structure with embedded semiconductor chip and fabrication method thereof
UNIMICRON TECHNOLOGY CORP4 citations62
US8035127B2Oct 11, 2011
Packaging substrate structure with a semiconductor chip embedded therein
UNIMICRON TECHNOLOGY CORP6 citations62
US7863729B2Jan 4, 2011
Circuit board structure embedded with semiconductor chips
UNIMICRON TECHNOLOGY CORP5 citations62
USD969745SNov 15, 2022
Electronic connector
UNIMICRON TECHNOLOGY CORP0 citations59
US10952325B2Mar 16, 2021
Printed circuit board stack structure and method of forming the same
UNIMICRON TECHNOLOGY CORP1 citations59
PHOENIX PREC TECHNOLOGY CORP
3 patentsUS7719104B2May 18, 2010
Circuit board structure with embedded semiconductor chip and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP14 citations83
US7365272B2Apr 29, 2008
Circuit board with identifiable information and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP13 citations82
US7598610B2Oct 6, 2009
Plate structure having chip embedded therein and the manufacturing method of the same
PHOENIX PREC TECHNOLOGY CORP7 citations73
RITDISPLAY CORP
3 patentsUS6858874B2Feb 22, 2005
Package structure of organic electroluminescence panel
RITDISPLAY CORP6 citations58
US7208870B2Apr 24, 2007
Silver alloy used in an organic electroluminescent panel
RITDISPLAY CORP0 citations47
US6846687B2Jan 25, 2005
Process of packaging organic electroluminescent panel
RITDISPLAY CORP0 citations39