Inventor
MAKI HIROSHI
JP55 patents
⚠️ This page may combine multiple inventors who share the name “MAKI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO CHEMICAL CO
9 patentsUS4073831AFeb 14, 1978
Thermoplastic resin composition
SUMITOMO CHEMICAL CO59 citations95
US4308406ADec 29, 1981
Method for preventing the discoloration of dihydric phenols
SUMITOMO CHEMICAL CO29 citations92
US4075285AFeb 21, 1978
Rubber-modified polystyrene resin composition
SUMITOMO CHEMICAL CO22 citations81
US4017436AApr 12, 1977
Thermoplastic resin composition
SUMITOMO CHEMICAL CO26 citations81
US5276193AJan 4, 1994
Process for preparing N-alkyl-substituted aminophenols
SUMITOMO CHEMICAL CO8 citations73
US5202485AApr 13, 1993
Process for preparing N-alkylaminophenols
SUMITOMO CHEMICAL CO7 citations69
US4967004AOct 30, 1990
Process for producing N,N-diethylaminophenols
SUMITOMO CHEMICAL CO4 citations63
US4585896AApr 29, 1986
Process for the production of an aminophenol
SUMITOMO CHEMICAL CO3 citations62
US4486605ADec 4, 1984
Method for producing aromatic carbonyl compounds
SUMITOMO CHEMICAL CO2 citations61
MAKI HIROSHI
9 patentsUS8450150B2May 28, 2013
Manufacturing method of semiconductor integrated circuit device
MAKI HIROSHI9 citations84
US8292159B2Oct 23, 2012
Fabrication method of semiconductor integrated circuit device
MAKI HIROSHI8 citations83
US8991681B2Mar 31, 2015
Die bonder and bonding method
MAKI HIROSHI16 citations81
US8703583B2Apr 22, 2014
Fabrication method of semiconductor device
MAKI HIROSHI12 citations81
US8074868B2Dec 13, 2011
Fabrication method of semiconductor integrated circuit device
MAKI HIROSHI4 citations73
US8211261B2Jul 3, 2012
Semiconductor manufacturing method of die pick-up from wafer
MAKI HIROSHI5 citations72
US8561664B2Oct 22, 2013
Die bonder, pickup method, and pickup device
MAKI HIROSHI3 citations63
US8640943B2Feb 4, 2014
Fabrication method of semiconductor integrated circuit device
MAKI HIROSHI1 citations62
US8222050B2Jul 17, 2012
Manufacturing method for semiconductor integrated device
MAKI HIROSHI0 citations50
RENESAS ELECTRONICS CORP
8 patentsUS7888141B2Feb 15, 2011
Manufacturing method for semiconductor integrated device
RENESAS ELECTRONICS CORP8 citations82
US7861912B2Jan 4, 2011
Fabrication method of semiconductor integrated circuit device
RENESAS ELECTRONICS CORP5 citations74
US8492173B2Jul 23, 2013
Manufacturing method for semiconductor integrated device
RENESAS ELECTRONICS CORP2 citations61
US8372665B2Feb 12, 2013
Manufacturing method for semiconductor integrated device
RENESAS ELECTRONICS CORP1 citations61
US8003495B2Aug 23, 2011
Manufacturing method for semiconductor integrated device
RENESAS ELECTRONICS CORP1 citations61
US7824932B2Nov 2, 2010
Fabrication method of semiconductor device
RENESAS ELECTRONICS CORP4 citations60
US8574933B2Nov 5, 2013
Fabrication method of semiconductor device
RENESAS ELECTRONICS CORP0 citations49
US8367433B2Feb 5, 2013
Fabrication method of semiconductor device
RENESAS ELECTRONICS CORP0 citations49
NIKON CORP
4 patentsUS6345895B1Feb 12, 2002
Projection type display apparatus
NIKON CORP64 citations96
US6010221AJan 4, 2000
Projection type display apparatus
NIKON CORP63 citations96
US6609796B2Aug 26, 2003
Projection type display apparatus
NIKON CORP23 citations92
US6844979B2Jan 18, 2005
Projection display apparatus
NIKON CORP18 citations90
RENESAS TECH CORP
4 patentsUS7759164B2Jul 20, 2010
Semiconductor manufacturing method of die pick-up from wafer
RENESAS TECH CORP18 citations91
US7757930B2Jul 20, 2010
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP9 citations84
US7498241B2Mar 3, 2009
Semiconductor manufacturing method of die pick-up from wafer
RENESAS TECH CORP11 citations82
US7629231B2Dec 8, 2009
Fabrication method of semiconductor device
RENESAS TECH CORP13 citations81
RENESAS E JP SEMICONDUCTOR INC
3 patentsUS7115482B2Oct 3, 2006
Method of manufacturing semiconductor device
RENESAS E JP SEMICONDUCTOR INC30 citations89
US7015071B2Mar 21, 2006
Method of manufacturing a semiconductor device
RENESAS E JP SEMICONDUCTOR INC10 citations74
US7270258B2Sep 18, 2007
Method of fabrication of semiconductor integrated circuit device
RENESAS E JP SEMICONDUCTOR INC9 citations73
DAINIPPON INK & CHEMICALS
2 patentsFASFORD TECH CO LTD
2 patentsTOYOTA BOSHOKU KK
2 patentsKENWOOD CORP
1 patentANDO SHOICHIRO
1 patentNIPPON KOKAN KK
1 patentMOCHIZUKI MASAYUKI
1 patentALCARE CO LTD
1 patentTAKAGI SUSUMU
1 patentYAMAGAMI TAKASHI
1 patentShowing the top 50 of 55 patents by PatentIndex Score.