Inventor
MERGILI LOTHAR
DE3 patents
Patents
3 patentsUS6368948B1Apr 9, 2002
Method of forming capped copper interconnects with reduced hillocks
ADVANCED MICRO DEVICES INC25 citations91
US6596631B1Jul 22, 2003
Method of forming copper interconnect capping layers with improved interface and adhesion
ADVANCED MICRO DEVICES INC17 citations83
US7375032B2May 20, 2008
Semiconductor substrate thinning method for manufacturing thinned die
ADVANCED MICRO DEVICES INC11 citations82