Inventor

CASTRO ABRAM M

US20 patents

⚠️ This page may combine multiple inventors who share the name “CASTRO ABRAM M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CASTRO ABRAM M

TEXAS INSTRUMENTS INC

Method for low stress flip-chip assembly of fine-pitch semiconductor devices

Packaged system of semiconductor chips having a semiconductor interposer

Packed system of semiconductor chips having a semiconductor interposer

Semiconductor package-on-package system including integrated passive components

Integrated circuit chip with a vertical connector

Multi-lead adapter

Integrated circuit package electronic device

Multi-lead adapter

Integrated circuit package electronic device including pillar contacts and electrical terminations

Integrated circuit chip with a vertical connector

SUBSTRATE TECHNOLOGIES INC

Ball grid substrate for lead-on-chip semiconductor package

Ball grid substrate for lead-on-chip semiconductor package

Sequentially built integrated circuit package

Substrate for an integrated circuit package

Method for making a substrate for an integrated circuit package

CASTRO ABRAM M

Semiconductor flip-chip system having oblong connectors and reduced trace pitches

Method for low stress flip-chip assembly of fine-pitch semiconductor devices

AMKOR ELECTRONICS INC

Thermally enhanced chip carrier package

GERBER MARK A

Packaged system of semiconductor chips having a semiconductor interposer

TOUCH FUTURE TECHNOLOCY LTD

Electrical circuit and method of formation