Inventor
LEE WEN-HSI
TW22 patents
⚠️ This page may combine multiple inventors who share the name “LEE WEN-HSI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
9 patentsUS12464790B2Nov 4, 2025
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12289877B2Apr 29, 2025
Semiconductor device including unilaterally extending gates and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12021117B2Jun 25, 2024
Semiconductor structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11844205B2Dec 12, 2023
Semiconductor device including trimmed-gates and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11587937B2Feb 21, 2023
Method of forming semiconductor device including trimmed-gates
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11037935B2Jun 15, 2021
Semiconductor device including trimmed-gates
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10840330B2Nov 17, 2020
Block layer in the metal gate of MOS devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9735231B2Aug 15, 2017
Block layer in the metal gate of MOS devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US10373962B2Aug 6, 2019
Semiconductor device including trimmed-gates and method for generating layout of same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
UNIV NAT CHENG KUNG
6 patentsUS9928947B1Mar 27, 2018
Method of fabricating highly conductive low-ohmic chip resistor having electrodes of base metal or base-metal alloy
UNIV NAT CHENG KUNG7 citations72
US11810720B2Nov 7, 2023
Method for fabricating terminal electrode of multilayer ceramic capacitor having inner electrodes printed on full area together with protective layers
UNIV NAT CHENG KUNG0 citations62
US8815632B2Aug 26, 2014
Order vacancy compound and method of manufacturing the same
UNIV NAT CHENG KUNG0 citations51
US10290403B2May 14, 2019
Methods of fabricating chip resistors using aluminum terminal electrodes
UNIV NAT CHENG KUNG0 citations41
US10174210B2Jan 8, 2019
Method of fabricating high-conductivity thick-film aluminum paste
UNIV NAT CHENG KUNG0 citations41
US9552908B2Jan 24, 2017
Chip resistor device having terminal electrodes
UNIV NAT CHENG KUNG0 citations41
YAGEO CORP
3 patentsUS7381283B2Jun 3, 2008
Method for reducing shrinkage during sintering low-temperature-cofired ceramics
YAGEO CORP37 citations91
US6893710B2May 17, 2005
Multilayer ceramic composition
YAGEO CORP16 citations78
US7138352B2Nov 21, 2006
Dielectric material and the method of preparing the same
YAGEO CORP5 citations59