Inventor
SOEJIMA KOJI
JP48 patents
⚠️ This page may combine multiple inventors who share the name “SOEJIMA KOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
14 patentsUS6114864ASep 5, 2000
Probe card with plural probe tips on a unitary flexible tongue
NEC CORP152 citations99
US6307392B1Oct 23, 2001
Probe card and method of forming a probe card
NEC CORP96 citations98
US8039756B2Oct 18, 2011
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same
NEC CORP20 citations93
US7791186B2Sep 7, 2010
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
NEC CORP17 citations93
US6307159B1Oct 23, 2001
Bump structure and method for making the same
NEC CORP32 citations92
US7880295B2Feb 1, 2011
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
NEC CORP9 citations84
US7348673B2Mar 25, 2008
Semiconductor device
NEC CORP13 citations84
US7242828B2Jul 10, 2007
Optical circuit in which fabrication is easy
NEC CORP9 citations74
US5936845AAug 10, 1999
IC package and IC probe card with organic substrate
NEC CORP13 citations74
US8050050B2Nov 1, 2011
Wiring board, semiconductor device, and method of manufacturing the same
NEC CORP2 citations63
US6670208B2Dec 30, 2003
Optical circuit in which fabrication is easy
NEC CORP3 citations63
US6625883B2Sep 30, 2003
Method for making a bump structure
NEC CORP2 citations63
US6096259AAug 1, 2000
Fabrication method of plastic-molded lead component
NEC CORP6 citations63
US7889514B2Feb 15, 2011
Wiring board, semiconductor device, and method of manufacturing the same
NEC CORP1 citations52
RENESAS ELECTRONICS CORP
14 patentsUS9406602B2Aug 2, 2016
Electronic device
RENESAS ELECTRONICS CORP9 citations93
US8633591B2Jan 21, 2014
Electronic device
RENESAS ELECTRONICS CORP10 citations93
US8354340B2Jan 15, 2013
Electronic device and method of manufacturing the same
RENESAS ELECTRONICS CORP23 citations93
US8035231B2Oct 11, 2011
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP17 citations93
US10224318B2Mar 5, 2019
Electronic device
RENESAS ELECTRONICS CORP6 citations84
US9847325B2Dec 19, 2017
Electronic device
RENESAS ELECTRONICS CORP3 citations84
US8975750B2Mar 10, 2015
Electronic device
RENESAS ELECTRONICS CORP7 citations84
US8823174B2Sep 2, 2014
Electronic device
RENESAS ELECTRONICS CORP7 citations84
US7928001B2Apr 19, 2011
Electronic device and method of manufacturing the same
RENESAS ELECTRONICS CORP14 citations84
US7892973B2Feb 22, 2011
Method for manufacturing a semiconductor device
RENESAS ELECTRONICS CORP9 citations84
US7927999B2Apr 19, 2011
Method of forming metal interconnect layers for flip chip device
RENESAS ELECTRONICS CORP2 citations63
US10879227B2Dec 29, 2020
Electronic device
RENESAS ELECTRONICS CORP0 citations52
US10580763B2Mar 3, 2020
Electronic device
RENESAS ELECTRONICS CORP0 citations52
US8030201B2Oct 4, 2011
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations52
NEC ELECTRONICS CORP
10 patentsUS7800233B2Sep 21, 2010
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP32 citations93
US7633167B2Dec 15, 2009
Semiconductor device and method for manufacturing same
NEC ELECTRONICS CORP21 citations93
US7598117B2Oct 6, 2009
Method for manufacturing semiconductor module using interconnection structure
NEC ELECTRONICS CORP26 citations93
US7528068B2May 5, 2009
Method for manufacturing semiconductor device
NEC ELECTRONICS CORP26 citations93
US7538022B2May 26, 2009
Method of manufacturing electronic circuit device
NEC ELECTRONICS CORP8 citations84
US7759786B2Jul 20, 2010
Electronic circuit chip, and electronic circuit device and method for manufacturing the same
NEC ELECTRONICS CORP5 citations63
US7656046B2Feb 2, 2010
Semiconductor device
NEC ELECTRONICS CORP6 citations63
US7652375B2Jan 26, 2010
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP0 citations52
US7202108B2Apr 10, 2007
Semiconductor wafer, semiconductor chip and method for manufacturing the same
NEC ELECTRONICS CORP0 citations52
US7495345B2Feb 24, 2009
Semiconductor device-composing substrate and semiconductor device
NEC ELECTRONICS CORP0 citations42
KAWANO MASAYA
4 patentsUS8058165B2Nov 15, 2011
Semiconductor device and method of manufacturing the same
KAWANO MASAYA17 citations92
US8395269B2Mar 12, 2013
Method of stacking semiconductor chips including forming an interconnect member and a through electrode
KAWANO MASAYA10 citations84
US8456019B2Jun 4, 2013
Semiconductor device
KAWANO MASAYA1 citations63
US8183685B2May 22, 2012
Semiconductor device
KAWANO MASAYA1 citations63