Inventor

CHUNG CHIH-MING

TW30 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG CHIH-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG CHIH-MING

ADVANCED SEMICONDUCTOR ENG

Flip chip package and manufacturing method thereof

Multi-chip package substrate for flip-chip and wire bonding

Substrate structure of BGA semiconductor package

Chip package structure, package substrate and manufacturing method thereof

Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame

Semiconductor package and method for manufacturing the same

Process for fabricating chip package structure

Chip package structure

Semiconductor chip package and manufacturing method thereof

Chip-scale semiconductor package

Manufacturing method of package substrate

Chip package structure

Method for flip chip bonding by utilizing an interposer with embedded bumps

Circuit carrier and semiconductor package using the same

Method for manufacturing semiconductor package

APPLE INC

Fan out system in package and method for forming the same

PoP structure with electrically insulating material between packages

Fan-out pop stacking process

Thermally enhanced package-on-package structure

Semiconductor packaging substrate fine pitch metal bump and reinforcement structures

Semiconductor packaging substrate fine pitch metal bump and reinforcement structures

Fan-out PoP stacking process

PoP structure with electrically insulating material between packages

Thin substrate PoP structure

G TECH OPTOELECTRONICS CORP

Display cover glass

Forming mold and related forming device and forming method using same

ADVANCE SEMICONDUCTOR ENGINEER

Stacked flip chip package

CHUNG CHIH-MING

Thin substrate PoP structure

G-TECH OPTOELECTRONICS CORP

Tempered glass screen protector applied to a portable electronic device

CHAO SHIN-HUA

Semiconductor package and manufacturing method thereof