Inventor
LIU CHAO-CHENG
TW3 patents
Patents
3 patentsUS7834469B2Nov 16, 2010
Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame
ADVANCED SEMICONDUCTOR ENG12 citations80
US7902650B2Mar 8, 2011
Semiconductor package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG7 citations79
US10157821B1Dec 18, 2018
Semiconductor packages
ADVANCED SEMICONDUCTOR ENG6 citations67