Inventor

CHEN SHYNG-TSONG

US57 patents

⚠️ This page may combine multiple inventors who share the name “CHEN SHYNG-TSONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN SHYNG-TSONG

IBM

Grooved polishing pads and methods of use

Selective capping of copper wiring

Copper recess process with application to selective capping and electroless plating

Grooved polishing pads and methods of use

Multilayered polishing pad, method for fabricating, and use thereof

Interconnect with recessed dielectric adjacent a noble metal cap

Metal resistor, resistor material and method

Selective capping of copper wiring

Copper recess process with application to selective capping and electroless plating

Selective thin metal cap process

Fine-pitch device lithography using a sacrificial hardmask

Polishing pads with polymer filled fibrous web, and methods for fabricating and using same

Polishing pad grooving method and apparatus

Line level air gaps

Stacked polish pad

Single damascene interconnect structure

Via gouging methods and related semiconductor structure

Surface treatment of inter-layer dielectric

Metal capping process for BEOL interconnect with air gaps

Via formation using sidewall image transfer process to define lateral dimension

Via formation using sidewall image transfer process to define lateral dimension

Method of repairing process induced dielectric damage by the use of GCIB surface treatment using gas clusters of organic molecular species

Polishing pads with polymer filled fibrous web, and methods for fabricating and using same

Method of forming an interconnect structure

Enhanced mechanical strength via contacts

Enhanced mechanical strength via contacts

Back end of the line structures with liner and noble metal layer

Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias

Resistive memory crossbar array compatible with Cu metallization

Resistive memory crossbar array with top electrode inner spacers

Resistive memory crossbar array with top electrode inner spacers

Magnetoresistive random-access memory (MRAM) with preserved underlying dielectric layer

Interconnect structures including self aligned vias

Interconnect structures including self aligned vias

Via design optimization to improve via resistance

Surface modified dielectric refill structure

Resistive memory crossbar array compatible with Cu metallization

Profile control in interconnect structures

Enhanced mechanical strength via contacts

Resistive memory crossbar array with top electrode inner spacers

FREUDENBERG NONWOVENS LTD

Fiber embedded polishing pad

Fiber embedded polishing pad

YANG CHIH-CHAO

Method of fabricating a profile control in interconnect structures

Method for fabricating back end of the line structures with liner and seed materials

CHEN SHYNG-TSONG

Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming same

Self-aligned dual damascene BEOL structures with patternable low-k material and methods of forming same

LIN QINGHUANG

Interconnect structures with patternable low-k dielectrics and method of fabricating same

Interconnect structures with patternable low-k dielectrics and method of fabricating same

NOGAMI TAKESHI

Formation of air gap with protection of metal lines

FITZSIMMONS JOHN A

Titanium-nitride removal