Inventor

NGUYEN HAU

US18 patents

⚠️ This page may combine multiple inventors who share the name “NGUYEN HAU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NGUYEN HAU

TEXAS INSTRUMENTS INC

Open cavity package using chip-embedding technology

Printed repassivation for wafer chip scale packaging

Metal ribs in electromechanical devices

Semiconductor systems having premolded dual leadframes

Bump bond structure for enhanced electromigration performance

Semiconductor device package with thermal pad

Metal ribs in electromechanical devices

Integrated circuit backside metallization

Integrated circuit backside metallization

Bump bond structure for enhanced electromigration performance

Flip chip packaged devices with thermal pad

Semiconductor systems having dual leadframes

Package for stress sensitive component and semiconductor device

NAT SEMICONDUCTOR CORP

Integrated circuit device package having a support coating for improved reliability during temperature cycling

Methods and arrangements for forming solder joint connections

Conductive paths for transmitting an electrical signal through an electrical connector

High strength solder joint formation method for wafer level packages and flip applications

PODDAR ANINYDA

Foil-based method for packaging intergrated circuits