Inventor
KIM WOON CHUN
KR27 patents
⚠️ This page may combine multiple inventors who share the name “KIM WOON CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
9 patentsUS7886414B2Feb 15, 2011
Method of manufacturing capacitor-embedded PCB
SAMSUNG ELECTRO MECH7 citations83
US9105378B2Aug 11, 2015
Graphene transparent electrode and method for manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US10242243B2Mar 26, 2019
Fingerprint sensor having printed circuit board and method of manufacture
SAMSUNG ELECTRO MECH2 citations70
US8760436B2Jun 24, 2014
Mutual capacitive touch panel
SAMSUNG ELECTRO MECH2 citations62
US8355011B2Jan 15, 2013
Resistive touch screen
SAMSUNG ELECTRO MECH2 citations62
US7992296B2Aug 9, 2011
PCB and manufacturing method thereof
SAMSUNG ELECTRO MECH4 citations62
US9519366B2Dec 13, 2016
Touch sensor
SAMSUNG ELECTRO MECH2 citations61
US8366008B2Feb 5, 2013
Radio frequency identification tag, and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations58
US9105844B2Aug 11, 2015
Piezoelectric device with piezoelectric polymer material
SAMSUNG ELECTRO MECH2 citations57
KIM WOON CHUN
8 patentsUS8416208B2Apr 9, 2013
Display apparatus having touch screen panel
KIM WOON CHUN5 citations72
US8692791B2Apr 8, 2014
Touch panel
KIM WOON CHUN3 citations62
US8466891B2Jun 18, 2013
Touch panel
KIM WOON CHUN2 citations62
US8446388B2May 21, 2013
Resistive touch screen
KIM WOON CHUN3 citations62
US8421332B2Apr 16, 2013
Capacitive touch screen and method for manufacturing the same
KIM WOON CHUN3 citations62
US8421768B2Apr 16, 2013
Touch screen device
KIM WOON CHUN0 citations52
US8698763B2Apr 15, 2014
Touch panel
KIM WOON CHUN1 citations51
US8576196B2Nov 5, 2013
Touch screen and method of manufacturing the same
KIM WOON CHUN0 citations51
KIM WOON-CHUN
5 patentsUS8159071B2Apr 17, 2012
Semiconductor package with a metal post
KIM WOON-CHUN5 citations73
US8302270B2Nov 6, 2012
Method of manufacturing capacitor-embedded PCB
KIM WOON-CHUN3 citations61
US8130508B2Mar 6, 2012
Electronic component embedded printed circuit board and manufacturing method thereof
KIM WOON-CHUN3 citations61
US8409981B2Apr 2, 2013
Semiconductor package with a metal post and manufacturing method thereof
KIM WOON-CHUN0 citations51
US8266792B2Sep 18, 2012
Method of manufacturing a printed circuit board with an embedded electronic component
KIM WOON-CHUN0 citations50
SAMSUNG ELECTRONICS CO LTD
4 patentsUS10790255B2Sep 29, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US10847474B2Nov 24, 2020
Semiconductor package and electromagnetic interference shielding structure for the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US12417990B2Sep 16, 2025
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US10741510B2Aug 11, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations41