Inventor

LIU CHENG-HSIANG

TW4 patents

⚠️ This page may combine multiple inventors who share the name “LIU CHENG-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

2 patents

US8878356B2Nov 4, 2014

Package structure having micro-electro-mechanical system element and method of fabrication the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations46

US10201086B2Feb 5, 2019

Electronic device

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations45

LIN CHEN-HAN

1 patent

US8633048B2Jan 21, 2014

Method for fabricating package structure having MEMS elements

LIN CHEN-HAN1 citations47

WINBOND ELECTRONICS CORP

1 patent

US11152270B2Oct 19, 2021

Monitoring structure for critical dimension of lithography process

WINBOND ELECTRONICS CORP0 citations46