Inventor

LIAO HSIN-YI

TW21 patents

⚠️ This page may combine multiple inventors who share the name “LIAO HSIN-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIAO HSIN-YI

SILICONWARE PRECISION INDUSTRIES CO LTD

Fabrication method of package structure having MEMS element

Method of fabricating a semiconductor package

Method for fabricating an encapsulated electronic package using a supporting plate

Fabrication method of wafer level package having a pressure sensor

Package structure having MEMS element

Fabrication method of semiconductor package

Method for manufacturing package structure with micro-electromechanical element

Electronic package and method for fabricating the same

Package structure having micro-electro-mechanical system element and method of fabrication the same

CHIU CHI-HSIN

Fabrication method of package structure having MEMS element

Package structure having MEMS element

CHANG CHIANG-CHENG

Chip scale package with electronic component received in encapsulant, and fabrication method thereof

Chip scale package and fabrication method thereof

CHANG HONG-DA

Wafer level package having a pressure sensor and fabrication method thereof

Semiconductor package and method of fabricating the same

LIN CHEN-HAN

Package structure having MEMS elements and fabrication method thereof

Method for fabricating package structure having MEMS elements

HUANG CHUN-AN

Package structure with micro-electromechanical element and manufacturing method thereof

Package structure having MEMS element and fabrication method thereof

POWERCHIP SEMICONDUCTOR MFG CORP

Method of manufacturing memory structure

CHEN YAN-HENG

Semiconductor package, package structure and fabrication method thereof