Inventor
SUGIURA RYUJI
JP21 patents
⚠️ This page may combine multiple inventors who share the name “SUGIURA RYUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HAMAMATSU PHOTONICS KK
9 patentsUS7902636B2Mar 8, 2011
Semiconductor chip including a substrate and multilayer part
HAMAMATSU PHOTONICS KK127 citations99
US7897487B2Mar 1, 2011
Laser processing method and chip
HAMAMATSU PHOTONICS KK132 citations99
US7939430B2May 10, 2011
Laser processing method
HAMAMATSU PHOTONICS KK132 citations98
US8043941B2Oct 25, 2011
Laser processing method and chip
HAMAMATSU PHOTONICS KK6 citations74
US11211250B2Dec 28, 2021
Laminated element manufacturing method
HAMAMATSU PHOTONICS KK3 citations72
US8865566B2Oct 21, 2014
Method of cutting semiconductor substrate
HAMAMATSU PHOTONICS KK3 citations63
US11817319B2Nov 14, 2023
Laminated element manufacturing method
HAMAMATSU PHOTONICS KK0 citations62
US11158601B2Oct 26, 2021
Laminated element manufacturing method
HAMAMATSU PHOTONICS KK0 citations51
US11069672B2Jul 20, 2021
Laminated element manufacturing method
HAMAMATSU PHOTONICS KK0 citations51
SUGIURA RYUJI
5 patentsUS8143141B2Mar 27, 2012
Laser beam machining method and semiconductor chip
SUGIURA RYUJI44 citations97
US9076855B2Jul 7, 2015
Laser machining method
SUGIURA RYUJI14 citations83
US9035216B2May 19, 2015
Method and device for controlling interior fractures by controlling the laser pulse width
SUGIURA RYUJI16 citations83
US8338271B2Dec 25, 2012
Laser processing method and chip
SUGIURA RYUJI7 citations83
US9409256B2Aug 9, 2016
Laser processing method
SUGIURA RYUJI0 citations41
FUKUYO FUMITSUGU
3 patentsUS8263479B2Sep 11, 2012
Method for cutting semiconductor substrate
FUKUYO FUMITSUGU44 citations98
US8450187B2May 28, 2013
Method of cutting semiconductor substrate
FUKUYO FUMITSUGU6 citations84
US8409968B2Apr 2, 2013
Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion
FUKUYO FUMITSUGU3 citations63