Inventor
BLACKSHEAR EDMUND D
US12 patents
⚠️ This page may combine multiple inventors who share the name “BLACKSHEAR EDMUND D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS6774475B2Aug 10, 2004
Vertically stacked memory chips in FBGA packages
IBM65 citations94
US7095104B2Aug 22, 2006
Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same
IBM53 citations91
US6507122B2Jan 14, 2003
Pre-bond encapsulation of area array terminated chip and wafer scale packages
IBM28 citations91
US6312972B1Nov 6, 2001
Pre-bond encapsulation of area array terminated chip and wafer scale packages
IBM18 citations91
US5095699AMar 17, 1992
Stirling type cylinder force amplifier
IBM17 citations72
US10813215B2Oct 20, 2020
Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance
IBM0 citations52
US10806030B2Oct 13, 2020
Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance
IBM0 citations52
US10687420B2Jun 16, 2020
Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance
IBM0 citations52