P

Inventor

BOGEN INGO

DE20 patents
⚠️ This page may combine multiple inventors who share the name “BOGEN INGO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEMIKRON ELEKTRONIK GMBH & CO KG

15 patents
USD892754SAug 11, 2020

Power module

SEMIKRON ELEKTRONIK GMBH & CO KG18 citations92
US10090774B1Oct 2, 2018

Power electronic arrangement with DC voltage connection element

SEMIKRON ELEKTRONIK GMBH & CO KG14 citations82
US10157806B2Dec 18, 2018

Power electronic submodule comprising a bipartite housing

SEMIKRON ELEKTRONIK GMBH & CO KG2 citations72
US11387588B2Jul 12, 2022

Power semiconductor module with press-fit contact element

SEMIKRON ELEKTRONIK GMBH & CO KG2 citations71
USD883241SMay 5, 2020

Power module

SEMIKRON ELEKTRONIK GMBH & CO KG3 citations71
US10270358B2Apr 23, 2019

Power electronics submodule having DC and AC voltage terminal elements, and assembly hereof

SEMIKRON ELEKTRONIK GMBH & CO KG3 citations71
US10163761B2Dec 25, 2018

Power semiconductor arrangement

SEMIKRON ELEKTRONIK GMBH & CO KG6 citations71
USD889423SJul 7, 2020

Power module

SEMIKRON ELEKTRONIK GMBH & CO KG1 citations61
US12094797B2Sep 17, 2024

Pressing device for directly or indirectly applying pressure to power-semiconductor components of a power-semiconductor module

SEMIKRON ELEKTRONIK GMBH & CO KG0 citations56
US9462708B2Oct 4, 2016

Power semiconductor device

SEMIKRON ELEKTRONIK GMBH & CO KG1 citations51
US11533822B2Dec 20, 2022

Power electronics submodule for mounting on a cooling device

SEMIKRON ELEKTRONIK GMBH & CO KG0 citations50
US11791740B2Oct 17, 2023

Power electronic arrangement with DC voltage connection element and method for its production

SEMIKRON ELEKTRONIK GMBH & CO KG0 citations47
US11800644B2Oct 24, 2023

Power electronic switching device, power semiconductor module therewith and method for production

SEMIKRON ELEKTRONIK GMBH & CO KG0 citations46
US12362312B2Jul 15, 2025

Power semiconductor module having a substrate arrangement, having power semiconductor components and having a foil stack arrangement

SEMIKRON ELEKTRONIK GMBH & CO KG0 citations43
US10603741B2Mar 31, 2020

Apparatus for the material-bonded connection of connection partners of a power-electronics component

SEMIKRON ELEKTRONIK GMBH & CO KG0 citations31

SEMIKRON DANFOSS INT GMBH

2 patents

SEMIKRON ELEKTRONIK GMBH

2 patents

BAYERISCHE MOTOREN WERKE AG

1 patent