Inventor
BOGEN INGO
DE20 patents
⚠️ This page may combine multiple inventors who share the name “BOGEN INGO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMIKRON ELEKTRONIK GMBH & CO KG
15 patentsUSD892754SAug 11, 2020
Power module
SEMIKRON ELEKTRONIK GMBH & CO KG18 citations92
US10090774B1Oct 2, 2018
Power electronic arrangement with DC voltage connection element
SEMIKRON ELEKTRONIK GMBH & CO KG14 citations82
US10157806B2Dec 18, 2018
Power electronic submodule comprising a bipartite housing
SEMIKRON ELEKTRONIK GMBH & CO KG2 citations72
US11387588B2Jul 12, 2022
Power semiconductor module with press-fit contact element
SEMIKRON ELEKTRONIK GMBH & CO KG2 citations71
USD883241SMay 5, 2020
Power module
SEMIKRON ELEKTRONIK GMBH & CO KG3 citations71
US10270358B2Apr 23, 2019
Power electronics submodule having DC and AC voltage terminal elements, and assembly hereof
SEMIKRON ELEKTRONIK GMBH & CO KG3 citations71
US10163761B2Dec 25, 2018
Power semiconductor arrangement
SEMIKRON ELEKTRONIK GMBH & CO KG6 citations71
USD889423SJul 7, 2020
Power module
SEMIKRON ELEKTRONIK GMBH & CO KG1 citations61
US12094797B2Sep 17, 2024
Pressing device for directly or indirectly applying pressure to power-semiconductor components of a power-semiconductor module
SEMIKRON ELEKTRONIK GMBH & CO KG0 citations56
US9462708B2Oct 4, 2016
Power semiconductor device
SEMIKRON ELEKTRONIK GMBH & CO KG1 citations51
US11533822B2Dec 20, 2022
Power electronics submodule for mounting on a cooling device
SEMIKRON ELEKTRONIK GMBH & CO KG0 citations50
US11791740B2Oct 17, 2023
Power electronic arrangement with DC voltage connection element and method for its production
SEMIKRON ELEKTRONIK GMBH & CO KG0 citations47
US11800644B2Oct 24, 2023
Power electronic switching device, power semiconductor module therewith and method for production
SEMIKRON ELEKTRONIK GMBH & CO KG0 citations46
US12362312B2Jul 15, 2025
Power semiconductor module having a substrate arrangement, having power semiconductor components and having a foil stack arrangement
SEMIKRON ELEKTRONIK GMBH & CO KG0 citations43
US10603741B2Mar 31, 2020
Apparatus for the material-bonded connection of connection partners of a power-electronics component
SEMIKRON ELEKTRONIK GMBH & CO KG0 citations31