Inventor
HSU SHIH-HSUN
TW37 patents
⚠️ This page may combine multiple inventors who share the name “HSU SHIH-HSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS11302738B2Apr 12, 2022
Image sensor with improved quantum efficiency surface structure
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations86
US10665627B2May 26, 2020
Image sensor device and method for forming the image sensor device having a first lens and a second lens over the first lens
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10644060B2May 5, 2020
Image sensor with high quantum efficiency surface structure
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10283548B1May 7, 2019
CMOS sensors and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US11222913B2Jan 11, 2022
Image sensor device having first lens over a light-sensing region and surrounded by a grid layer
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11189657B2Nov 30, 2021
Image sensor with improved quantum efficiency surface structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11901390B2Feb 13, 2024
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12324258B2Jun 3, 2025
Image sensor with improved quantum efficiency surface structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11791356B2Oct 17, 2023
Image sensor device having a first lens and a second lens over the first lens
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12364049B2Jul 15, 2025
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11177308B2Nov 16, 2021
CMOS sensors and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12021099B2Jun 25, 2024
Embedded light shield structure for CMOS image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10522585B2Dec 31, 2019
Method for manufacturing CMOS image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
TAIWAN SEMICONDUCTOR MFG
9 patentsUS7235424B2Jun 26, 2007
Method and apparatus for enhanced CMP planarization using surrounded dummy design
TAIWAN SEMICONDUCTOR MFG150 citations98
US7646078B2Jan 12, 2010
Die saw crack stopper
TAIWAN SEMICONDUCTOR MFG25 citations92
US8772137B2Jul 8, 2014
Semiconductor wafer with assisting dicing structure and dicing method thereof
TAIWAN SEMICONDUCTOR MFG7 citations84
US7679384B2Mar 16, 2010
Parametric testline with increased test pattern areas
TAIWAN SEMICONDUCTOR MFG12 citations84
US7538346B2May 26, 2009
Semiconductor device
TAIWAN SEMICONDUCTOR MFG5 citations74
US7714443B2May 11, 2010
Pad structure design with reduced density
TAIWAN SEMICONDUCTOR MFG7 citations73
US7692274B2Apr 6, 2010
Reinforced semiconductor structures
TAIWAN SEMICONDUCTOR MFG6 citations63
US7834351B2Nov 16, 2010
Semiconductor device
TAIWAN SEMICONDUCTOR MFG0 citations52
US8993355B2Mar 31, 2015
Test line placement to improve die sawing quality
TAIWAN SEMICONDUCTOR MFG1 citations50
UNITED MICROELECTRONICS CORP
4 patentsUS6660627B2Dec 9, 2003
Method for planarization of wafers with high selectivities
UNITED MICROELECTRONICS CORP9 citations73
US6797190B2Sep 28, 2004
Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same
UNITED MICROELECTRONICS CORP5 citations62
US6709544B2Mar 23, 2004
Chemical mechanical polishing equipment
UNITED MICROELECTRONICS CORP4 citations62
US6638391B1Oct 28, 2003
Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same
UNITED MICROELECTRONICS CORP5 citations62
CHEN HSIEN-WEI
3 patentsUS8629532B2Jan 14, 2014
Semiconductor wafer with assisting dicing structure and dicing method thereof
CHEN HSIEN-WEI6 citations84
US8749020B2Jun 10, 2014
Metal e-fuse structure design
CHEN HSIEN-WEI3 citations63
US8125233B2Feb 28, 2012
Parametric testline with increased test pattern areas
CHEN HSIEN-WEI1 citations52