Inventor
CHEN HAOBO
US12 patents
⚠️ This page may combine multiple inventors who share the name “CHEN HAOBO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
9 patentsUS11837534B2Dec 5, 2023
Substrate with variable height conductive and dielectric elements
INTEL CORP2 citations72
US12568831B2Mar 3, 2026
Patternable die attach materials and processes for patterning
INTEL CORP0 citations61
US11923312B2Mar 5, 2024
Patternable die attach materials and processes for patterning
INTEL CORP0 citations61
US12412868B2Sep 9, 2025
Microelectronic assemblies including interconnects with different solder materials
INTEL CORP0 citations60
US12354883B2Jul 8, 2025
Omni directional interconnect with magnetic fillers in mold matrix
INTEL CORP0 citations59
US12027466B2Jul 2, 2024
Conductive route patterning for electronic substrates
INTEL CORP0 citations51
US12449600B2Oct 21, 2025
Position controlled waveguides and methods of manufacturing the same
INTEL CORP0 citations50
US12334447B2Jun 17, 2025
Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI)
INTEL CORP0 citations48
US12255130B2Mar 18, 2025
Airgap structures for high speed signal integrity
INTEL CORP0 citations48