Inventor
MARIN BRANDON
US11 patents
⚠️ This page may combine multiple inventors who share the name “MARIN BRANDON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS12313890B2May 27, 2025
Through-substrate optical vias
INTEL CORP0 citations62
US12253722B2Mar 18, 2025
Magneto-optical Kerr effect interconnects for photonic packaging
INTEL CORP0 citations62
US12224103B2Feb 11, 2025
Angled inductor with small form factor
INTEL CORP1 citations62
US12444672B2Oct 14, 2025
Hybrid bonding technologies with thermal expansion compensation structures
INTEL CORP0 citations61
US12394719B2Aug 19, 2025
Methods and apparatus to increase glass core thickness
INTEL CORP0 citations61
US12255147B2Mar 18, 2025
Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein
INTEL CORP0 citations61
US12074102B2Aug 27, 2024
Structural elements for application specific electronic device packages
INTEL CORP0 citations59
US11804420B2Oct 31, 2023
Core-shell particles for magnetic packaging
INTEL CORP1 citations59
US12449600B2Oct 21, 2025
Position controlled waveguides and methods of manufacturing the same
INTEL CORP0 citations50
US12033930B2Jul 9, 2024
Selectively roughened copper architectures for low insertion loss conductive features
INTEL CORP0 citations47