Inventor
CHANG MAO-YEN
TW18 patents
Patents
18 patentsUS11848300B2Dec 19, 2023
Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US11646255B2May 9, 2023
Chip package structure including a silicon substrate interposer and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11424213B2Aug 23, 2022
Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11004827B2May 11, 2021
Semiconductor package and manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10461023B2Oct 29, 2019
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations70
US12538827B2Jan 27, 2026
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12500219B2Dec 16, 2025
Trimming and sawing processes in the formation of wafer-form packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12406961B2Sep 2, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12278208B2Apr 15, 2025
Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12107064B2Oct 1, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12014976B2Jun 18, 2024
Chip package structure including a silicon substrate interposer and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11942451B2Mar 26, 2024
Semiconductor structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11322421B2May 3, 2022
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12166015B2Dec 10, 2024
Semiconductor package and manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11646296B2May 9, 2023
Semiconductor package and manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12512451B2Dec 30, 2025
Semiconductor package and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12374592B2Jul 29, 2025
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12525501B2Jan 13, 2026
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49