Inventor
YANG KUO-YUH
TW42 patents
⚠️ This page may combine multiple inventors who share the name “YANG KUO-YUH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
36 patentsUS10460980B2Oct 29, 2019
Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the same
UNITED MICROELECTRONICS CORP17 citations94
US11205605B2Dec 21, 2021
Semiconductor structure with back gate and method of fabricating the same
UNITED MICROELECTRONICS CORP5 citations84
US9048285B2Jun 2, 2015
Semiconductor structure and method of forming a harmonic-effect-suppression structure
UNITED MICROELECTRONICS CORP6 citations84
US11205609B2Dec 21, 2021
Semiconductor structure with an air gap
UNITED MICROELECTRONICS CORP7 citations83
US11152485B2Oct 19, 2021
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP1 citations73
US11133270B1Sep 28, 2021
Integrated circuit device and fabrication method thereof
UNITED MICROELECTRONICS CORP2 citations73
US11127700B1Sep 21, 2021
Integrated circuit device
UNITED MICROELECTRONICS CORP4 citations73
US10636892B2Apr 28, 2020
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP3 citations73
US10411110B1Sep 10, 2019
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP3 citations73
US12249545B2Mar 11, 2025
Integrated circuit device
UNITED MICROELECTRONICS CORP0 citations62
US12132011B2Oct 29, 2024
Integrated circuit device and fabrication method thereof
UNITED MICROELECTRONICS CORP0 citations62
US12087712B2Sep 10, 2024
Method for fabricating an integrated circuit device
UNITED MICROELECTRONICS CORP0 citations62
US11848253B2Dec 19, 2023
Semiconductor structure with an air gap
UNITED MICROELECTRONICS CORP0 citations62
US11721757B2Aug 8, 2023
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations62
US11658118B2May 23, 2023
Transistor structure in low noise amplifier
UNITED MICROELECTRONICS CORP0 citations62
US11658087B2May 23, 2023
High resistivity wafer with heat dissipation structure and method of making the same
UNITED MICROELECTRONICS CORP0 citations62
US11652017B2May 16, 2023
High resistivity wafer with heat dissipation structure and method of making the same
UNITED MICROELECTRONICS CORP0 citations62
US11637080B2Apr 25, 2023
Method for fabricating an integrated circuit device
UNITED MICROELECTRONICS CORP0 citations62
US11521891B2Dec 6, 2022
Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the same
UNITED MICROELECTRONICS CORP0 citations62
US11476192B2Oct 18, 2022
Transistor structure in low noise amplifier
UNITED MICROELECTRONICS CORP0 citations62
US11462489B2Oct 4, 2022
Integrated circuit device and fabrication method thereof
UNITED MICROELECTRONICS CORP0 citations62
US11201115B2Dec 14, 2021
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations62
US11152484B2Oct 19, 2021
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations62
US11114562B2Sep 7, 2021
Semiconductor device
UNITED MICROELECTRONICS CORP1 citations62
US11101165B2Aug 24, 2021
Method for fabricating semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate
UNITED MICROELECTRONICS CORP0 citations62
US11094599B2Aug 17, 2021
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations62
US10347712B1Jul 9, 2019
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP1 citations62
US12532734B2Jan 20, 2026
Semiconductor device and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations59
US6455371B1Sep 24, 2002
Method for forming capacitor of a DRAM having a wall protection structure
UNITED MICROELECTRONICS CORP4 citations58
US12382702B2Aug 5, 2025
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations56
US11894439B2Feb 6, 2024
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations56
US12131976B2Oct 29, 2024
Semiconductor structure with heat dissipation structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations52
US10854529B2Dec 1, 2020
High resistivity wafer with heat dissipation structure and method of making the same
UNITED MICROELECTRONICS CORP0 citations52
US10679944B2Jun 9, 2020
Semiconductor structure with high resistivity wafer and fabricating method of bonding the same
UNITED MICROELECTRONICS CORP0 citations52
US10600734B2Mar 24, 2020
Transistor structure in low noise amplifier
UNITED MICROELECTRONICS CORP0 citations52
US9378998B2Jun 28, 2016
Semiconductor structure and method of forming a harmonic-effect-suppression structure
UNITED MICROELECTRONICS CORP0 citations52
HSU CHANG-SHENG
3 patentsUS8536709B1Sep 17, 2013
Wafer with eutectic bonding carrier and method of manufacturing the same
HSU CHANG-SHENG8 citations80
US8776363B2Jul 15, 2014
Method for supporting semiconductor wafer and wafer supporting assembly
HSU CHANG-SHENG3 citations59
US8754504B2Jun 17, 2014
Thinned wafer and fabricating method thereof
HSU CHANG-SHENG1 citations48