P

Inventor

YANG KUO-YUH

TW42 patents
⚠️ This page may combine multiple inventors who share the name “YANG KUO-YUH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

36 patents
US10460980B2Oct 29, 2019

Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the same

UNITED MICROELECTRONICS CORP17 citations94
US11205605B2Dec 21, 2021

Semiconductor structure with back gate and method of fabricating the same

UNITED MICROELECTRONICS CORP5 citations84
US9048285B2Jun 2, 2015

Semiconductor structure and method of forming a harmonic-effect-suppression structure

UNITED MICROELECTRONICS CORP6 citations84
US11205609B2Dec 21, 2021

Semiconductor structure with an air gap

UNITED MICROELECTRONICS CORP7 citations83
US11152485B2Oct 19, 2021

Semiconductor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP1 citations73
US11133270B1Sep 28, 2021

Integrated circuit device and fabrication method thereof

UNITED MICROELECTRONICS CORP2 citations73
US11127700B1Sep 21, 2021

Integrated circuit device

UNITED MICROELECTRONICS CORP4 citations73
US10636892B2Apr 28, 2020

Semiconductor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP3 citations73
US10411110B1Sep 10, 2019

Semiconductor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP3 citations73
US12249545B2Mar 11, 2025

Integrated circuit device

UNITED MICROELECTRONICS CORP0 citations62
US12132011B2Oct 29, 2024

Integrated circuit device and fabrication method thereof

UNITED MICROELECTRONICS CORP0 citations62
US12087712B2Sep 10, 2024

Method for fabricating an integrated circuit device

UNITED MICROELECTRONICS CORP0 citations62
US11848253B2Dec 19, 2023

Semiconductor structure with an air gap

UNITED MICROELECTRONICS CORP0 citations62
US11721757B2Aug 8, 2023

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations62
US11658118B2May 23, 2023

Transistor structure in low noise amplifier

UNITED MICROELECTRONICS CORP0 citations62
US11658087B2May 23, 2023

High resistivity wafer with heat dissipation structure and method of making the same

UNITED MICROELECTRONICS CORP0 citations62
US11652017B2May 16, 2023

High resistivity wafer with heat dissipation structure and method of making the same

UNITED MICROELECTRONICS CORP0 citations62
US11637080B2Apr 25, 2023

Method for fabricating an integrated circuit device

UNITED MICROELECTRONICS CORP0 citations62
US11521891B2Dec 6, 2022

Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the same

UNITED MICROELECTRONICS CORP0 citations62
US11476192B2Oct 18, 2022

Transistor structure in low noise amplifier

UNITED MICROELECTRONICS CORP0 citations62
US11462489B2Oct 4, 2022

Integrated circuit device and fabrication method thereof

UNITED MICROELECTRONICS CORP0 citations62
US11201115B2Dec 14, 2021

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations62
US11152484B2Oct 19, 2021

Semiconductor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP0 citations62
US11114562B2Sep 7, 2021

Semiconductor device

UNITED MICROELECTRONICS CORP1 citations62
US11101165B2Aug 24, 2021

Method for fabricating semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate

UNITED MICROELECTRONICS CORP0 citations62
US11094599B2Aug 17, 2021

Semiconductor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP0 citations62
US10347712B1Jul 9, 2019

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP1 citations62
US12532734B2Jan 20, 2026

Semiconductor device and method of fabricating the same

UNITED MICROELECTRONICS CORP0 citations59
US6455371B1Sep 24, 2002

Method for forming capacitor of a DRAM having a wall protection structure

UNITED MICROELECTRONICS CORP4 citations58
US12382702B2Aug 5, 2025

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations56
US11894439B2Feb 6, 2024

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations56
US12131976B2Oct 29, 2024

Semiconductor structure with heat dissipation structure and method of fabricating the same

UNITED MICROELECTRONICS CORP0 citations52
US10854529B2Dec 1, 2020

High resistivity wafer with heat dissipation structure and method of making the same

UNITED MICROELECTRONICS CORP0 citations52
US10679944B2Jun 9, 2020

Semiconductor structure with high resistivity wafer and fabricating method of bonding the same

UNITED MICROELECTRONICS CORP0 citations52
US10600734B2Mar 24, 2020

Transistor structure in low noise amplifier

UNITED MICROELECTRONICS CORP0 citations52
US9378998B2Jun 28, 2016

Semiconductor structure and method of forming a harmonic-effect-suppression structure

UNITED MICROELECTRONICS CORP0 citations52

HSU CHANG-SHENG

3 patents

LIN CHIA-HUEI

1 patent

UNITED MICROELECTRONICS CORPS

1 patent

LIN YU-TSUNG

1 patent