Inventor
NAKAMURA NORIMASA
JP19 patents
⚠️ This page may combine multiple inventors who share the name “NAKAMURA NORIMASA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NISSHIN SPINNING
14 patentsUS6440258B1Aug 27, 2002
Adhesive film for semiconductor package
NISSHIN SPINNING22 citations92
US6103836AAug 15, 2000
Epoxy resin composition
NISSHIN SPINNING19 citations92
US7368493B2May 6, 2008
Carbodiimide composition with suppressed yellowing, a stabilizer against hydrolysis and a thermoplastic resin composition
NISSHIN SPINNING14 citations84
US7361701B2Apr 22, 2008
Aliphatic polyester composition, a molded article thereof and a method for controlling biodegradation rate using the same composition
NISSHIN SPINNING15 citations83
US6846860B2Jan 25, 2005
Biodegradable plastic composition, a molded article thereof and a method for controlling biodegradation rate
NISSHIN SPINNING13 citations83
US6485833B1Nov 26, 2002
Resin-coated metal foil
NISSHIN SPINNING9 citations73
US6387505B1May 14, 2002
Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board
NISSHIN SPINNING7 citations73
US6331226B1Dec 18, 2001
LCP bonding method
NISSHIN SPINNING11 citations73
US6225417B1May 1, 2001
One-pack type epoxy resin composition
NISSHIN SPINNING6 citations73
US6090906AJul 18, 2000
Polycarbodiimide copolymer and process for production thereof
NISSHIN SPINNING12 citations73
US5650476AJul 22, 1997
Process for production of polycarbodiimide resin powder
NISSHIN SPINNING11 citations73
US6420035B1Jul 16, 2002
Metal material subjected to treatment for seizure prevention and method for production thereof
NISSHIN SPINNING6 citations68
US6524711B2Feb 25, 2003
Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition
NISSHIN SPINNING4 citations62
US6310119B1Oct 30, 2001
Film-shaped encapsulating agent for electronic parts
NISSHIN SPINNING1 citations52