Inventor
OKUNO TATSUYA
JP25 patents
⚠️ This page may combine multiple inventors who share the name “OKUNO TATSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PANASONIC IP MAN CO LTD
10 patentsUS9774010B2Sep 26, 2017
Light reflective material and light-emitting device
PANASONIC IP MAN CO LTD7 citations84
US10836958B2Nov 17, 2020
Wavelength conversion member
PANASONIC IP MAN CO LTD7 citations82
US11371675B2Jun 28, 2022
Light emitting device
PANASONIC IP MAN CO LTD0 citations62
US10355175B2Jul 16, 2019
Light emitting device
PANASONIC IP MAN CO LTD1 citations61
US11898343B2Feb 13, 2024
Water-repellent member, and building member and wet room member using same
PANASONIC IP MAN CO LTD0 citations59
US11435059B2Sep 6, 2022
Wavelength conversion member and white light emitting device using same
PANASONIC IP MAN CO LTD0 citations52
US11384920B2Jul 12, 2022
Illumination device
PANASONIC IP MAN CO LTD0 citations52
US10651348B2May 12, 2020
Light emitting device
PANASONIC IP MAN CO LTD0 citations51
US11131914B2Sep 28, 2021
Wavelength conversion member
PANASONIC IP MAN CO LTD0 citations50
US9640783B2May 2, 2017
Light emitting device with reflective layer including filler particles
PANASONIC IP MAN CO LTD0 citations37
SUNSTAR ENGINEERING INC
9 patentsUS4851481AJul 25, 1989
Epoxy resin composition
SUNSTAR ENGINEERING INC65 citations96
US6660943B1Dec 9, 2003
Underfilling material for semiconductor package
SUNSTAR ENGINEERING INC25 citations90
US6110993AAug 29, 2000
Thermosetting epoxy resin composition
SUNSTAR ENGINEERING INC16 citations84
US4788233ANov 29, 1988
Epoxy resin composition
SUNSTAR ENGINEERING INC10 citations73
US6066690AMay 23, 2000
Heat-vulcanizable rubber composition
SUNSTAR ENGINEERING INC11 citations70
US5866668AFeb 2, 1999
Heat curable composition
SUNSTAR ENGINEERING INC12 citations68
US5079313AJan 7, 1992
Polymer dispersing agent and epoxy resin composition
SUNSTAR ENGINEERING INC14 citations68
US10189937B2Jan 29, 2019
Fine powder-coated amine and composition containing same
SUNSTAR ENGINEERING INC1 citations53
US7449362B2Nov 11, 2008
One-component hot-setting epoxy resin composition and semiconductor mounting underfill material
SUNSTAR ENGINEERING INC1 citations50