Inventor
HAYAKAWA YUKIHIRO
JP33 patents
⚠️ This page may combine multiple inventors who share the name “HAYAKAWA YUKIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CANON KK
27 patentsUS6143190ANov 7, 2000
Method of producing a through-hole, silicon substrate having a through-hole, device using such a substrate, method of producing an ink-jet print head, and ink-jet print head
CANON KK151 citations99
US5376231ADec 27, 1994
Substrate for recording head, recording head and method for producing same
CANON KK94 citations95
US6467884B1Oct 22, 2002
Substrate unit for liquid discharging head, method for producing the same, liquid discharging head, cartridge, and image forming apparatus
CANON KK33 citations92
US6450621B1Sep 17, 2002
Semiconductor device having inkjet recording capability and method for manufacturing the same, inkjet head using semiconductor device, recording apparatus, and information-processing system
CANON KK22 citations92
US5776255AJul 7, 1998
Chemical vapor deposition apparatus
CANON KK43 citations92
US5653810AAug 5, 1997
Apparatus for forming metal film and process for forming metal film
CANON KK28 citations92
US5580822ADec 3, 1996
Chemical vapor deposition method
CANON KK27 citations92
US5447568ASep 5, 1995
Chemical vapor deposition method and apparatus making use of liquid starting material
CANON KK33 citations92
US6962405B2Nov 8, 2005
Substrate for ink jet recording head, ink jet recording head and ink jet recording apparatus using ink jet recording head
CANON KK15 citations84
US6875365B2Apr 5, 2005
Method for producing liquid discharge head
CANON KK15 citations84
US6475563B2Nov 5, 2002
Method for forming a thin film using a gas
CANON KK14 citations84
US9030587B2May 12, 2015
Solid-state image sensor with light-guiding portion
CANON KK8 citations83
US7056798B2Jun 6, 2006
Semiconductor device, method for manufacturing the same, and liquid jet apparatus
CANON KK7 citations74
US6825543B2Nov 30, 2004
Semiconductor device, method for manufacturing the same, and liquid jet apparatus
CANON KK11 citations74
US6004885ADec 21, 1999
Thin film formation on semiconductor wafer
CANON KK13 citations73
US6838351B2Jan 4, 2005
Manufacturing method of circuit board, circuit board, and liquid discharging apparatus
CANON KK10 citations71
US6867457B2Mar 15, 2005
Semiconductor device and liquid jetting device using the same
CANON KK2 citations63
US7055937B2Jun 6, 2006
Heat generating resistant element film, substrate for ink jet head utilizing the same, ink jet head and ink jet apparatus
CANON KK3 citations62
US6964471B2Nov 15, 2005
Heating resistor film, recording head substrate, recording head, and recording apparatus
CANON KK4 citations62
US6799839B2Oct 5, 2004
Structure provided with through hole, method of manufacture therefor, and liquid discharge head
CANON KK3 citations62
US7270398B2Sep 18, 2007
Circuit board and liquid discharging apparatus
CANON KK2 citations60
US7244370B2Jul 17, 2007
Method for producing circuit substrate
CANON KK4 citations60
US8771528B2Jul 8, 2014
Through-hole forming method and inkjet head
CANON KK1 citations52
US9769401B2Sep 19, 2017
Solid-state imaging apparatus, method of manufacturing the same, and camera
CANON KK1 citations51
US7270759B2Sep 18, 2007
Structure with through hole, production method thereof, and liquid discharge head
CANON KK0 citations50
US7018020B2Mar 28, 2006
Structure with through hole, production method thereof, and liquid discharge head
CANON KK1 citations50
US9373659B2Jun 21, 2016
Method of manufacturing solid-state image pickup apparatus
CANON KK0 citations41