Inventor

TOYAMA KOHEI

JP18 patents

⚠️ This page may combine multiple inventors who share the name “TOYAMA KOHEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOYAMA KOHEI

SHINETSU HANDOTAI KK

Wire saw and slicing method using the same

Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer

Wire saw cutting apparatus synchronizing workpiece feed speed with wire speed

Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing

Method of slicing semiconductor single crystal ingot

System for reusing oily slurry waste fluid

Wire saw cutting method synchronizing workpiece feed speed with wire speed

Wire saw slicing apparatus and slicing method using the same

Recovery of coolant and abrasive grains used in slicing semiconductor wafers

Method of manufacturing wire for use in a wire saw and wire for use in a wire saw

Method of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine therein

Method of using an id saw slicing machine for slicing a single crystal ingot and an apparatus for carrying out the method

Cutting fluid, method for production thereof, and method for cutting ingot

Method of manufacturing semiconductor wafers

DENSO CORP

Vehicle-mounted sensor cleaning device

Lidar apparatus

Lidar device

SHIN ESTU HANDOTAI CO LTD

Apparatus and method for chamfering wafer with loose abrasive grains