Inventor
OUIMET SYLVAIN
CA16 patents
⚠️ This page may combine multiple inventors who share the name “OUIMET SYLVAIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS5781682AJul 14, 1998
Low-cost packaging for parallel optical computer link
IBM72 citations93
US6137158AOct 24, 2000
Leadframe and leadframe assembly for parallel optical computer link
IBM18 citations90
US9793232B1Oct 17, 2017
All intermetallic compound with stand off feature and method to make
IBM2 citations72
US10615511B2Apr 7, 2020
Antenna packaging solution
IBM2 citations71
US10374322B2Aug 6, 2019
Antenna packaging solution
IBM3 citations71
US6414386B1Jul 2, 2002
Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings
IBM9 citations69
US11211262B2Dec 28, 2021
Electronic apparatus having inter-chip stiffener
IBM0 citations62
US6605526B1Aug 12, 2003
Wirebond passivation pad connection using heated capillary
IBM4 citations60
US6946746B2Sep 20, 2005
Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings
IBM1 citations58
US7771541B2Aug 10, 2010
Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces
IBM0 citations49
US6737296B2May 18, 2004
Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings
IBM0 citations48
US9219051B2Dec 22, 2015
Laminate peripheral clamping to control microelectronic module BSM warpage
IBM1 citations45