Inventor
THUMMEL STEVEN G
US19 patents
⚠️ This page may combine multiple inventors who share the name “THUMMEL STEVEN G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
18 patentsUS6332766B1Dec 25, 2001
Apparatus for encasing array packages
MICRON TECHNOLOGY INC135 citations99
US6326244B1Dec 4, 2001
Method of making a cavity ball grid array apparatus
MICRON TECHNOLOGY INC376 citations99
US6247629B1Jun 19, 2001
Wire bond monitoring system for layered packages
MICRON TECHNOLOGY INC144 citations99
US6117382ASep 12, 2000
Method for encasing array packages
MICRON TECHNOLOGY INC151 citations99
US6084297AJul 4, 2000
Cavity ball grid array apparatus
MICRON TECHNOLOGY INC319 citations99
US5893726AApr 13, 1999
Semiconductor package with pre-fabricated cover and method of fabrication
MICRON TECHNOLOGY INC174 citations99
US6057597AMay 2, 2000
Semiconductor package with pre-fabricated cover
MICRON TECHNOLOGY INC107 citations98
US6989121B2Jan 24, 2006
Method for encasing plastic array packages
MICRON TECHNOLOGY INC60 citations96
US6577004B1Jun 10, 2003
Solder ball landpad design to improve laminate performance
MICRON TECHNOLOGY INC75 citations96
US6287503B1Sep 11, 2001
Method for encasing array packages
MICRON TECHNOLOGY INC28 citations96
US6982486B2Jan 3, 2006
Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same
MICRON TECHNOLOGY INC20 citations92
US6740971B2May 25, 2004
Cavity ball grid array apparatus having improved inductance characteristics
MICRON TECHNOLOGY INC16 citations92
US6626656B2Sep 30, 2003
Apparatus for encasing array packages
MICRON TECHNOLOGY INC18 citations92
US6085962AJul 11, 2000
Wire bond monitoring system for layered packages
MICRON TECHNOLOGY INC29 citations92
US7268013B2Sep 11, 2007
Method of fabricating a semiconductor die package having improved inductance characteristics
MICRON TECHNOLOGY INC6 citations74
US6616880B2Sep 9, 2003
Method for encasing array packages
MICRON TECHNOLOGY INC8 citations74
US6914326B2Jul 5, 2005
Solder ball landpad design to improve laminate performance
MICRON TECHNOLOGY INC11 citations71
US6893244B2May 17, 2005
Apparatus for encasing array packages
MICRON TECHNOLOGY INC2 citations63