P

Inventor

CHEUNG NATHAN W

US46 patents
⚠️ This page may combine multiple inventors who share the name “CHEUNG NATHAN W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICON GENESIS CORP

35 patents
US7371660B2May 13, 2008

Controlled cleaving process

SILICON GENESIS CORP289 citations99
US7160790B2Jan 9, 2007

Controlled cleaving process

SILICON GENESIS CORP70 citations99
US6790747B2Sep 14, 2004

Method and device for controlled cleaving process

SILICON GENESIS CORP239 citations99
US6632724B2Oct 14, 2003

Controlled cleaving process

SILICON GENESIS CORP163 citations99
US6548382B1Apr 15, 2003

Gettering technique for wafers made using a controlled cleaving process

SILICON GENESIS CORP162 citations99
US6486041B2Nov 26, 2002

Method and device for controlled cleaving process

SILICON GENESIS CORP124 citations99
US6458672B1Oct 1, 2002

Controlled cleavage process and resulting device using beta annealing

SILICON GENESIS CORP84 citations99
US6391740B1May 21, 2002

Generic layer transfer methodology by controlled cleavage process

SILICON GENESIS CORP163 citations99
US6290804B1Sep 18, 2001

Controlled cleavage process using patterning

SILICON GENESIS CORP121 citations99
US6284631B1Sep 4, 2001

Method and device for controlled cleaving process

SILICON GENESIS CORP86 citations99
US6245161B1Jun 12, 2001

Economical silicon-on-silicon hybrid wafer assembly

SILICON GENESIS CORP127 citations99
US6184111B1Feb 6, 2001

Pre-semiconductor process implant and post-process film separation

SILICON GENESIS CORP251 citations99
US6162705ADec 19, 2000

Controlled cleavage process and resulting device using beta annealing

SILICON GENESIS CORP113 citations99
US6159824ADec 12, 2000

Silicon-on-silicon wafer bonding process using a thin film blister-separation method

SILICON GENESIS CORP188 citations99
US6146979ANov 14, 2000

Pressurized microbubble thin film separation process using a reusable substrate

SILICON GENESIS CORP292 citations99
US6083324AJul 4, 2000

Gettering technique for silicon-on-insulator wafers

SILICON GENESIS CORP252 citations99
US6048411AApr 11, 2000

Silicon-on-silicon hybrid wafer assembly

SILICON GENESIS CORP266 citations99
US6033974AMar 7, 2000

Method for controlled cleaving process

SILICON GENESIS CORP386 citations99
US6013563AJan 11, 2000

Controlled cleaning process

SILICON GENESIS CORP330 citations99
US6010579AJan 4, 2000

Reusable substrate for thin film separation

SILICON GENESIS CORP254 citations99
US6890838B2May 10, 2005

Gettering technique for wafers made using a controlled cleaving process

SILICON GENESIS CORP71 citations98
US6534381B2Mar 18, 2003

Method for fabricating multi-layered substrates

SILICON GENESIS CORP139 citations98
US6558802B1May 6, 2003

Silicon-on-silicon hybrid wafer assembly

SILICON GENESIS CORP59 citations97
US6335264B1Jan 1, 2002

Controlled cleavage thin film separation process using a reusable substrate

SILICON GENESIS CORP60 citations97
US6294814B1Sep 25, 2001

Cleaved silicon thin film with rough surface

SILICON GENESIS CORP54 citations97
US6159825ADec 12, 2000

Controlled cleavage thin film separation process using a reusable substrate

SILICON GENESIS CORP74 citations97
US7410887B2Aug 12, 2008

Controlled process and resulting device

SILICON GENESIS CORP11 citations93
US6291326B1Sep 18, 2001

Pre-semiconductor process implant and post-process film separation

SILICON GENESIS CORP32 citations93
US6291314B1Sep 18, 2001

Controlled cleavage process and device for patterned films using a release layer

SILICON GENESIS CORP51 citations93
US6248649B1Jun 19, 2001

Controlled cleavage process and device for patterned films using patterned implants

SILICON GENESIS CORP52 citations93
US7776717B2Aug 17, 2010

Controlled process and resulting device

SILICON GENESIS CORP8 citations84
US7846818B2Dec 7, 2010

Controlled process and resulting device

SILICON GENESIS CORP4 citations82
US8012852B2Sep 6, 2011

Controlled process and resulting device

SILICON GENESIS CORP4 citations74
US7781305B2Aug 24, 2010

Controlled cleaving process

SILICON GENESIS CORP3 citations74
US7759217B2Jul 20, 2010

Controlled process and resulting device

SILICON GENESIS CORP4 citations74

UNIV CALIFORNIA

5 patents

CHAN YICK CHUEN

5 patents

UNVERSITY OF CALIFORNIA

1 patent