Inventor
MATSUURA TETSUYA
JP35 patents
⚠️ This page may combine multiple inventors who share the name “MATSUURA TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MURATA MACHINERY LTD
10 patentsUS11130274B2Sep 28, 2021
Filament winding apparatus
MURATA MACHINERY LTD2 citations72
US10532520B2Jan 14, 2020
Filament winding device
MURATA MACHINERY LTD2 citations72
US11931974B2Mar 19, 2024
Filament winding apparatus
MURATA MACHINERY LTD2 citations71
US11383425B2Jul 12, 2022
Filament winding device
MURATA MACHINERY LTD0 citations61
US11274015B2Mar 15, 2022
Filament winding device, and yarn threading method in filament winding device
MURATA MACHINERY LTD1 citations61
US11318661B2May 3, 2022
Filament winding device and bobbin replacement method
MURATA MACHINERY LTD0 citations51
US11931949B2Mar 19, 2024
Filament winding device
MURATA MACHINERY LTD0 citations50
US11472096B2Oct 18, 2022
Filament winding apparatus
MURATA MACHINERY LTD0 citations50
US11472095B2Oct 18, 2022
Filament winding apparatus
MURATA MACHINERY LTD0 citations50
US11440271B2Sep 13, 2022
Filament winding device
MURATA MACHINERY LTD0 citations50
MITSUBISHI ELECTRIC CORP
9 patentsUS6521984B2Feb 18, 2003
Semiconductor module with semiconductor devices attached to upper and lower surface of a semiconductor substrate
MITSUBISHI ELECTRIC CORP166 citations99
US6670701B2Dec 30, 2003
Semiconductor module and electronic component
MITSUBISHI ELECTRIC CORP48 citations92
USD465773SNov 19, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP9 citations73
USD461171SAug 6, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP8 citations73
USD459317SJun 25, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP9 citations73
USD460951SJul 30, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP4 citations62
USD460744SJul 23, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP2 citations62
USD459316SJun 25, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP5 citations62
USD458234SJun 4, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP2 citations62
RENESAS TECH CORP
4 patentsUS6777798B2Aug 17, 2004
Stacked semiconductor device structure
RENESAS TECH CORP37 citations92
US6717275B2Apr 6, 2004
Semiconductor module
RENESAS TECH CORP41 citations89
US6798056B2Sep 28, 2004
Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor package
RENESAS TECH CORP8 citations73
US6852571B2Feb 8, 2005
Method of manufacturing stacked semiconductor device
RENESAS TECH CORP0 citations41